The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $119.5 billion during the first quarter of 2023, a decrease of 8.7% compared to the fourth quarter of 2022 and 21.3% less than the first quarter of 2022.
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ASMC 2023 Opens With Advanced Semiconductor Manufacturing Excellence in Focus
More than 85 experts will offer insights on the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 34th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023), opening today in Saratoga Springs, New York.
MIT Engineers “Grow” Atomically Thin Transistors On Top of Computer Chips
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
Cadence Design Systems, Inc. today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp.
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Global Top 25 Tech Companies Gain Over $2.4T in Q1 2023 Despite Challenges, Reveals GlobalData
Despite the ongoing challenges posed by geopolitical issues and interest rate hikes, the global top 25 technology companies gained more than $2.4 trillion in valuation in the first quarter (Q1) of 2023, reveals GlobalData, a data and analytics company.
Neuralink Selects New Takano Wafer Particle Measurement System from ClassOne Equipment
ClassOne Equipment has announced the sale of its advanced new Takano particle measurement system to Neuralink Corp., the California-based developer of leading-edge brain-computer interfaces.
POET Technologies Introduces “POET Starlight” for the Artificial Intelligence Market
POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced “POET Starlight”, a packaged light source solution for AI applications.
SEMI Europe Applauds Provisional Agreement Reached in EU Chips Act Trilogue Negotiations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
