This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
AI
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm
Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
Silicon Labs, in partnership with Kudelski IoT, a division of the Kudelski Group, today announced a new solution to accelerate the time to market for Matter-certified IoT devices.
Introducing ChipAgents: the World’s First AI Agent for Chip Design and Verification
Today, Alpha Design AI announced the launch of ChipAgents, the world’s first AI agent designed to revolutionize chip design and verification workflows for hardware engineers and semiconductor companies.
SWAP Hub to Transform Satellite Imaging Performance Through Microelectronics-Enabled Artificial Intelligence
The U.S. Department of Defense has announced that the Southwest Advanced Prototyping (SWAP) Hub based at Arizona State University (ASU) has been awarded $5.9M in funding through the CHIPS and Science Act for the new Spaceborne Low Energy AI Computing (SLEAC).
Inflection AI and Intel Launch Enterprise AI System
Today, Inflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers.
Bruker Introduces Neuroscience Research Solution with High-Speed OptoVolt Voltage Imaging
At the Neuroscience 2024 conference, Bruker Corporation today announced the release of the OptoVolt module to further expand the advanced neuroscience research capabilities on Bruker’s Ultima multiphoton microscope platform.
Samsung Starts Mass Production of Industry’s Most Powerful PC SSD Optimal for AI Applications
Samsung Electronics today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity.
SWAP Hub Project Led by Idaho Scientific and Partners Awarded CHIPS Funding to Revolutionize IoT Security
The Southwest Advanced Prototyping (SWAP) Hub, based at Arizona State University, has been awarded nearly $7.8 million in funding by the CHIPS and Science Act for an innovative project led by Idaho Scientific to develop the ARC-V Secure Processor.
