At Intel Vision, Intel announced that Habana Labs, its data center team focused on AI deep learning processor technologies, launched its second-generation deep learning processors for training and inference.
AI
Tignis Announces $7.2 Million in Series A Funding
Tignis today announced the completion of $7.2 million in Series A Funding led by early-stage venture capital fund DN Capital with participation by Silicon Valley venture capital firm Clear Ventures.
AI Traffic Light System Could Make Traffic Jams a Distant Memory
Long queues at traffic lights could be a thing of the past, thanks to a new artificial intelligence system developed by Aston University researchers.
Classiq Announces the Classiq Coding Competition
Classiq today announced the Classiq Coding Competition, rewarding those that create highly-efficient quantum circuits to solve important real-world problems.
Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World’s First Universal Processor
Tachyum today launched the world’s first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.
Leia Inc. Unveils the Next Generation of 3D Displays to Democratize Access to the Metaverse
Leia Inc., a 3D experience platform leveraging proprietary nanotechnology and AI to democratize the Metaverse, today unveiled its next generation of 3D Lightfield displays, which offer a “window like” view into the Metaverse and will connect more people, faster.
Using AI to Analyze Large Amounts of Biological Data
University of Missouri researchers develop method which could be used by scientists when developing new drug therapies for medical treatment of cancers, other diseases.
New Shape Memory Alloy Discovered Through Artificial Intelligence Framework
Funded by the National Science Foundation’s Designing Materials to Revolutionize Our Engineering Future (DMREF) Program, researchers from the Department of Materials Science and Engineering at Texas A&M University used an Artificial Intelligence Materials Selection framework (AIMS) to discover a new shape memory alloy.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the
April/May issue online here.
OMNIVISION Debuts OAX4600 AI-Enabled ASIC at AutoSens
OMNIVISION announced today the automotive industry’s most advanced AI-enabled application-specific integrated circuit (ASIC) that can seamlessly and simultaneously power dedicated driver and occupant monitoring systems.
