AI

What’s in the July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. If you are at SEMICON West, stop by Booth 1733 and pick up a copy in print.

Nano Dimension Acquires Admatec and Formatec

Nano Dimension Ltd., a supplier of Additively Manufactured Electronics and multi-dimensional metal & ceramic Additive Manufacturing 3D printers, announced today that it has signed and closed a definitive agreement to acquire Formatec Holding B.V.

SEMI and Semiconductor Digest Announce 2022 Best of West Award Finalists

SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2022, July 12-14 at the Moscone Center in San Francisco.

SEMICON West 2022 Hybrid Keynotes and Executive Panels to Highlight CHIPS Act, Microelectronics Supply Chain Resilience, Sustainability, Mobility and Talent

The CHIPS Act, microelectronics industry resilience and the future of mobility will come into focus next week at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco.

Siemens and NVIDIA to Enable Industrial Metaverse

Siemens and NVIDIA today announced an expansion of their partnership to enable the industrial metaverse and increase use of AI-driven digital twin technology that will help bring industrial automation to a new level.

Anari AI Launched Thor X – the First “System-on-Cloud” for Processing 3D Point Clouds

A new Cloud-based technology “System-on-Cloud”, developed by the Anari AI team, introduces an optimized and efficient system from various different hardware and software architectures combined with machine learning models to revolutionize the way AI compute systems are utilized.

Intel Labs Announces Integrated Photonics Research Advancement

Intel demonstrates a tightly controlled eight-wavelength laser array on a silicon wafer with matched power and uniform spacing.

The Human Hand: Curating Good Data and Creating an Effective Deep-Learning R2R Strategy for High-Volume Manufacturing

Areas ideally suited for AI applications may be repetitive and mental labor-intensive tasks with good available data, or when analytical methods are not applicable or too difficult to find, or data interpolation.

SPIE Photonics Industry Summit Will Bring Policymakers and Optics and Photonics Industry Leaders Together

The day-long event will provide insight into US government efforts across many emerging technology areas enabled by optics and photonics seen as critical to the government’s long-term strategic goals, including AI, quantum, hypersonics, energy, and semiconductors.

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template

QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader in high speed, low latency, low power connectivity IP, today announced the industry’s first disaggregated eFPGA-enabled chiplet template solution.

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