NVIDIA today announced it is working with Google Quantum AI to accelerate the design of its next-generation quantum computing devices using simulations powered by the NVIDIA CUDA-Q platform.
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xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards 2025 Honoree
The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
NVIDIA’s AI-Driven Triumph Over Intel Powered by Strategic Innovations, GlobalData Reveals
In a historic shift, NVIDIA has taken Intel’s coveted spot on the Dow Jones Industrial Average.
Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan
To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.
RED Semiconductor Chosen for Silicon Catalyst Semiconductor Incubator
RED Semiconductor, a UK based startup innovating processors for AI and cryptography at the edge, has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator program.
Growth Ahead for Semiconductor Packaging Materials
Recovery driven by increase in overall semiconductor demand and AI.
INFICON Announces Formation of Advanced Data Science Team to Enable the Factories of the Future
INFICON announced the launch of a new global Data Science Team to centralize and expand its AI-focused initiatives in the Smart Manufacturing space.
Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD
Micron Technology, Inc. today announced it has begun qualification of the 6550 ION NVMe SSD with customers.
SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth
SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.
