Samsung Electronics Co. today announced its demonstration of the world’s first in-memory computing based on MRAM.
AI
AI, Cameras and Your Smartphone: Computing at the Edge and On the Go
An AI-powered camera using a dedicated co-processor chip with innovative deep learning algorithms can deliver a vision-based solution with unmatched performance, power efficiency, cost-effectiveness, and scalability.
Measuring Trust in AI
Prompted by the increasing prominence of artificial intelligence (AI) in society, University of Tokyo researchers investigated public attitudes toward the ethics of AI.
SEMI Reschedules Industry Strategy Symposium to April 3-6, 2022
SEMI today rescheduled the Industry Strategy Symposium (ISS) 2022 from January 9-12 to April 3-6 due to a resurgence of COVID-19 cases in the United States.
Survey: Understanding the Data-Centric Era
The Data-Centric Era is here. It demands highly flexible, high bandwidth and secure infrastructure to meet the demands of highly variable, large and diverse data. Composable infrastructure provides the flexibility, bandwidth and efficiency to meet that demand.
CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced NeuPro-M, its latest generation processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads.
Outlook for 2022: Executive Viewpoints
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and business trends. For 2022, in addition to ongoing technical advances, expect to see a focus on supply chain challenges, sustainability, the workforce shortage and reshoring.
Georgia Tech Wins Commerce Department Grant to Develop AI Manufacturing Economic Corridor
The Georgia Institute of Technology was awarded a grant from the U.S. Department of Commerce’s Economic Development Administration (EDA) as part of its $1 billion Build Back Better Regional Challenge.
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities
In order to enhance critical capabilities of Taiwan’s chip industry for this emerging market, the Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), Taiwan, has supported ITRI to establish the Heterogeneous Integration Chip-let System Package Alliance (Hi-CHIP).
North American Semiconductor Equipment Industry Posts November 2021 Billings
The billings figure is 5.0% higher than final October 2021 billings of $3.74 billion and 50.6% higher than November 2020 billings of $2.61 billion.
