Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.
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Blaize Announces $71M Series D Financing to Further Accelerate Growth
Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding.
What Trends Will Have the Biggest Impact on Semiconductor Design?
By Emily Newton, Editor-in-Chief of Revolutionized. Semiconductor design has progressively improved over the decades, and that will continue for the foreseeable future. Here are some fascinating trends that will likely shape the future of engineering at all stages of product development. Using artificial intelligence in semiconductor design Artificial intelligence (AI) is opening new possibilities in industries ranging from agriculture to medicine. It brings more opportunities to semiconductor design, too. Many…
NVIDIA Inference Breakthrough Makes Conversational AI Smarter, More Interactive From Cloud to Edge
NVIDIA today launched TensorRT 8, the eighth generation of the company’s AI software, which slashes inference time in half for language queries — enabling developers to build the world’s best-performing search engines, ad recommendations and chatbots and offer them from the cloud to the edge.
What’s in the June/July Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the June/July issue…
Atonarp Announces New Metrology Platform Aston
Atonarp, a manufacturer of molecular sensing and diagnostics products for the semiconductor, healthcare, and pharma industries, today announced Aston, an in-situ semiconductor metrology platform with an integrated plasma ionization source.
Canaan Releases Self-developed Edge AI Chip, the Kendryte K510
Canaan Inc., a high-performance computing solutions provider, today announced the release of the Kendryte K510, an independently designed and developed RISC-V based edge AI chip, at the 2021 World Artificial Intelligence Conference.
Winbond HyperRAM & SpiStack and Renesas RZ/A2M Accelerate the Construction of Embedded AI Systems
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
Renesas’ New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an innovative new IoT system design platform that significantly eases the prototyping of IoT systems.
Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment
Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together program.
