Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
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SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
Teradyne Announces New President of Universal Robots
Teradyne, Inc. today announced that Kim Povlsen has been appointed President of Universal Robots.
AI Chip Market Juggernaut Continues According to New Linley Group Report
Demand for deep-learning accelerator (DLA) chips, also known as artificial intelligence (AI) processors, continues to be strong in spite of the pandemic.
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York.
Adapdix Announces SoftBank Funding for Next-Generation Edge AI Platform
Adapdix Corporation, the digital transformation leader in Edge AI automation and intelligent control software, today announced that it has received funding from SoftBank’s Opportunity Fund, pushing the total investment amount secured by Adapdix up to $10 million.
Sensible 4 Tested Autonomous Driving Software in Finnish Lapland
Finnish self-driving technology company was testing its software in the Lapland of Finland for 2,5 weeks. The Temperature went even below -20°C, visibility distance was short, and roads were covered in snow – in other words, conditions were perfect for testing autonomous vehicles.
Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex LogixÒ for demanding Artificial Intelligence (AI) applications such as object recognition.
EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
EdgeQ Inc, a 5G systems-on-a-chip company, announced today that Dr. Paul Jacobs and Matt Grob have joined the advisory board.
Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
Following a decline of 12% in 2019, worldwide semiconductor revenue rebounded in 2020 to total $449.8 billion, an increase of 7.3% from 2019, according to preliminary results by Gartner, Inc.
