Intel today announced that it has signed an agreement with Defense Advanced Research Projects Agency (DARPA) to perform in its Data Protection in Virtual Environments (DPRIVE) program.
AI
Adapdix Appoints Jean Lau as CTO to Lead World-Class Edge AI Technology Team
Adapdix Corporation, the leader in EdgeOps automation software, today announced it has appointed Jean Lau as chief technology officer (CTO).
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives
SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
How Will a Post-Covid World Affect Users of Memory Technology?
Once the pandemic has passed, which changes in ordinary life are likely to endure? And how do memory IC manufacturers ensure that they are ready to meet the changed requirements of electronics device OEMs?
Broad Coalition of Tech, Medical, Auto, Other Business Leaders Urge President Biden to Fund Domestic Semiconductor Manufacturing, Research in Infrastructure Plan
The Semiconductor Industry Association (SIA), along with a broad coalition of 16 other tech, medical, auto, and other business groups, today in a letter urged President Biden to work with Congress to fully fund domestic semiconductor manufacturing and research provisions established in the recently enacted National Defense Authorization Act (NDAA).
Evan Petridis Joins Eta Compute
Eta Compute Inc., the leader in energy-efficient endpoint AI solutions for intelligent sensing anywhere, announced that Evan Petridis joined the company as Chief Product Officer and Executive Vice President of Systems Engineering.
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
Teradyne Announces New President of Universal Robots
Teradyne, Inc. today announced that Kim Povlsen has been appointed President of Universal Robots.
AI Chip Market Juggernaut Continues According to New Linley Group Report
Demand for deep-learning accelerator (DLA) chips, also known as artificial intelligence (AI) processors, continues to be strong in spite of the pandemic.
