CEA-Leti today announced an open-source project to produce physical True Random Number Generators (TRNG) using ring-oscillator-based architectures.
AI
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Infinera Receives CHIPS and Science Act Funds to Support Development of Semiconductor Technology Important for Communications and National Security
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio
Micron Technology, Inc., today announced the availability of a brand-new category of clock driver memory with the launch of its Crucial DDR5 clocked unbuffered dual inline memory modules (CUDIMM) and clocked small outline dual memory modules (CSODIMM), which are now shipping in volume.
SurplusGLOBAL Appoints Dr. Benjamin Jeong as Chief AI Officer
SurplusGLOBAL, a platform company specializing in semiconductor equipment and parts, is accelerating innovation in the semiconductor distribution industry by incorporating artificial intelligence (AI) technology.
SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production.
IMEC Announces Commitments to Automotive Chiplet Program
This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm
Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
Silicon Labs, in partnership with Kudelski IoT, a division of the Kudelski Group, today announced a new solution to accelerate the time to market for Matter-certified IoT devices.
