AI

NSF Awards $38M to Strengthen Research Infrastructure

The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.

Lambda Announces Strategic Partnership with SK Telecom to Expand Cloud Services in South Korea

Lambda, the AI developer cloud, today announced a partnership with South Korea’s largest mobile telecommunications company, SK Telecom (SKT).

Inspired by the Human Body, Engineer Designs Chips that Could Make Wearable AI More Energy Efficient

Is it possible to use artificial intelligence tools like ChatGPT without internet access?

AI Use Cases in Semiconductor Manufacturing and the Theory of Adjacent Possible

Keynote speaker at SEMI Pac NW event discussed specific AI use case examples in manufacturing before finishing with TAP and a Cambrian explosion.

SiFive Announces New High-Performance RISC-V Datacenter Processor for Demanding AI Workloads

Today, SiFive, Inc. announced its new SiFive Performance P870-D datacenter processor to meet customer requirements for highly parallelizable infrastructure workloads including video streaming, storage, and web appliances.

AMD Completes Acquisition of Silo AI

AMD today announced the completion of its acquisition of Silo AI, the largest private AI lab in Europe.

Cerabyte Joins CERN openlab

Cerabyte today announced that it has become an official CERN openlab member.

BrainChip Appoints New CMO, Enhances Scientific Advisory Board

BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it has hired Steven Brightfield as its new chief marketing officer and has re-envisioned its Scientific Advisory Board (SAB) by bringing on company founder Peter van der Made, Dr. Jason K. Eshraghian and Dr. André van Schaik.

New Substrate Material for Flexible Electronics Could Help Combat E-Waste

Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.

U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility

The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.

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