AI

BrainChip Announces Wafer Fabrication of the Akida System-on-Chip

BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power, high performance AI technology announced that the Company and Socionext Inc., it’s development, manufacturing and commercial partner, have provided its wafer fabrication partner, TSMC, with the completed Akida design files and the MultiProject Wafer (MPW) is scheduled to commence fabrication on 8 April 2020. Given the accelerated processing time for MPW wafers, engineering samples of the Akida device are expected to be available in the third quarter of 2020.

NXP’s New Wi-Fi 6 Portfolio Accelerates its Large-Scale Adoption Across IoT, Auto, Access and Industrial Markets

NXP Semiconductors N.V. today announced the availability of a comprehensive Wi-Fi 6 (802.11ax) portfolio, which significantly expands the number of products and markets able to adopt the latest Wi-Fi standards. NXP’s expanded Wi-Fi 6 portfolio represents the company’s new end-to-end vision and differentiated technology approach that is designed to help usher in an era of connectivity innovation for automotive, access, mobile and Industrial and IoT markets.

Kneron Hires Former Qualcomm Taipei Head of Engineering as Vice President of Engineering

Kneron, a leading on-device edge artificial intelligence (AI) solutions-provider based in San Diego, California, announces it has hired Davis Chen as Vice President of Engineering. Chen, a former Head of Engineering at Qualcomm Taipei, will be responsible for the leadership of the engineering teams at Kneron, developing the latest Edge AI technology.

COVID-19: Economic and Microelectronics Industry Impacts – Insights from McKinsey & Company

For five days in the latter half of March, the pall of the heavy human and economic toll COVID-19 has exacted in China appeared to be lifting.

Intel Allocates $6M to Coronavirus Relief

The Intel Foundation will provide $4 million to support coronavirus relief efforts in communities where the company has significant presence. The foundation will also offer a special match opportunity for every regular full-time and part-time employee and U.S. retiree to a total of $2 million for relief efforts around major Intel sites.

Juniper Research: Coronavirus to Cause $42 Billion Revenue Gap in Global Consumer Device Shipments over the Next 9 Months

New analysis from Juniper Research found that Coronavirus could cause around a $42 billion revenue gap over the next 9 months for smart device vendors. The analysis examined a number of key device verticals including smartphones, tablets, consumer robotics, smart speakers and smart wearables. Three impact scenarios, low, medium and high, illustrate a range of possible outcomes.

BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applications

BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power high performance AI technology today announced that Socionext Inc., a leader in advanced SoC solutions for video and imaging systems, will offer customers an Artificial Intelligence Platform that includes the Akida SoC, an ultra-low power high performance AI technology.

WWK Offering Operational Optimization Software at Cost

Wright Williams & Kelly, Inc. (WWK) (https://wwk.com), the global leader in Cloud-based cost and productivity management software and consulting services, announced today that it is offering access to its software platforms at cost to any organization shifting production to help fight the Covid-19 virus.

Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the new release of the Cadence® digital full flow—proven with hundreds of completed advanced-node tapeouts—has been enhanced to further optimize power, performance and area (PPA) results across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI). The flow features multiple industry-first capabilities including unified placement and physical optimization engines plus machine learning (ML) capabilities, enabling design excellence with up to 3X faster throughput and up to 20% improved PPA.

Putting Artificial Intelligence to Work in the Lab

An Australian-German collaboration has demonstrated fully-autonomous SPM operation, applying artificial intelligence and deep learning to remove the need for constant human supervision. The new system, dubbed DeepSPM, bridges the gap between nanoscience, automation and artificial intelligence (AI), and firmly establishes the use of machine learning for experimental scientific research.

Featured Products