IKBFU Physicists have successfully tested the new magnetic micro wire-based concept of “smart” composites production. The new composites are related to the multiferroic-class materials which have mutually controlled magnetic and electric properties. The effects observed in the compositions are considered to be a perspective platform for creating new devices from energy converters to highly sensitive sensors.
AI
AI Chipmaker Hailo Raises $60 Million in Series B Funding
Hailo, the leading AI chipmaker delivering unprecedented performance to edge devices, today announced it has raised $60 million in Series B funding. The round, led by existing investors, was joined by key strategic investors including ABB Technology Ventures (ATV) – the strategic VC arm of ABB, a global leader in industrial automation and robotics; NEC Corporation – a leader in the integration of IT and network technologies; and London-based VC firm Latitude Ventures.
SEMICON Southeast Asia 2020 Postponed to August 2020
SEMI announced today that it is postponing SEMICON Southeast Asia 2020, the region’s premier event for the global electronics manufacturing supply chain, from 12-14 May 2020to11-13 August 2020.The postponement is due to concern surrounding the ongoing international coronavirus (COVID-19) outbreak. The venue for SEMICON Southeast Asia 2020 will remain the Malaysia International Trade and Exhibition Centre (MITEC). “After close consultation with our stakeholders, which include partners, exhibitors, industry peers and the general…
BISTel Announces First Cloud Capable, A.I. Powered FDC System for Semiconductor Manufacturing
BISTel, the leading supplier of engineering automation and manufacturing A.I. applications announced today the semiconductor industry’s first cloud capable, A.I. powered, fault detection and classification system (FDC). The new FDC solution, called Dynamic Fault Detection (DFD) in the cloud, offers chipmakers a more comprehensive method for detecting faults.
Global Semiconductor Sales Down Slightly Year-to-Year in January
“The global semiconductor market got off to a solid start in 2020, with the industry nearly posting positive year-to-year sales growth for the first time in more than a year,” said John Neuffer, SIA president and CEO. “Still, the global market faces significant macroeconomic headwinds, including global trade unrest and ongoing concerns about worldwide spread of the coronavirus, which could limit continued market recovery.”
Cartesiam AI Development Environment Brings Artificial Intelligence, Learning and Inference to Everyday Objects
Cartesiam, a company that creates artificial intelligence (AI) software for embedded systems, today announced at the Embedded World conference the availability of NanoEdge™ AI Studio, the first integrated development environment (IDE) that enables machine learning and inference directly on Arm Cortex-M microcontrollers (MCUs).
GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity
GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
New Version of Si2 oaScript Expands IC Design Capabilities into the Cloud and AI
Design partitioning and multi-threaded parallel execution are key features of the updated scripting interface to OpenAccess, the industry’s most widely used IC design database. oaScript Version 4.0—developed by programming experts in the Silicon Integration Initiative oaScript Working Group—leverages the powerful enhancements available to OpenAccess in its most recent Data Model 6 upgrade.
Eta Compute Announces Production Silicon of the World’s Most Energy-efficient Edge AI Processor
Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices using its revolutionary new platform, announces the first shipment of production silicon for its ECM3532, the world’s first AI multicore processor for embedded sensor applications. This unique multicore device features the company’s patented Continuous Voltage Frequency Scaling (CVFS) and delivers power consumption of microwatts for many sensing applications.
BrainChip Akida Development Environment Now Freely Available to System Developers
BrainChip Holdings Ltd. (ASX: BRN), a leading provider of ultra-low power, high-performance edge AI technology, today announced that access to its Akida™ Development Environment (ADE) no longer requires pre-approval, now allowing designers to freely develop systems for edge and enterprise products on the company’s Akida Neural Processing technology.
