IC Insights recently released its October Update to The McClean Report 2019. Part of the update reviewed U.S. and China GDP and PMI trends in light of the current trade friction between the two nations.
AI
Award-winning Lattice sensAI Solutions Stack Further Extends Lead in Ultra Low-power AI at the Edge
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of performance enhancements and new and improved application reference designs for its award-winning sensAI™ solutions stack. sensAI helps OEMs develop AI and ML experiences for next-generation smart devices with power consumption measured in milliwatts.
NVIDIA Leads the Fast-Growing and Complex Edge AI Chipset Market but Competition is Intensifying
Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors. Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from US$2.6 billion in 2019 to US$7.6 billion by 2024, with no vendor commanding more than 40% of the market. The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing.
2019 Microprocessor Slump Snaps Nine Years of Record Sales
The microprocessor market’s string of nine straight record-high annual sales between 2010 and 2018 is expected to end this year with worldwide MPU revenue dropping 4% to about $77.3 billion because of weakness in smartphone shipments, excess inventories in data center computers, and the global fallout from the U.S.-China trade war, according to IC Insights’ recently updated forecast.
Lenovo and Intel Power Computational Research at the Flatiron Institute
Lenovo and Intel today revealed how their collaboration on joint technology solutions that accelerate the convergence of high-performance computing (HPC) and artificial intelligence (AI) is helping scientists at the Flatiron Institute solve scientific challenges in entirely new ways. The Flatiron Institute, located in New York City, is the internal research division of the Simons Foundation, whose mission is to advance the frontiers of research in mathematics and the basic sciences. Flatiron’s Scientific Computing Core supports scientific work there across four disciplines, requiring an HPC infrastructure to handle a variety of extremely large data files, from giant genomic sequencing files to 100,000 small files in a single directory.
Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors
Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World
Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
Erik Pederson Joins Semiconductor Industry Association as Government Affairs Director
The Semiconductor Industry Association (SIA) announced Erik Pederson has joined the association as government affairs director. In this role, Pederson will work with Congress, the White House, and federal agencies to advance the semiconductor industry’s policy priorities, particularly those related to trade, export control, and tax. SIA represents U.S. leadership in semiconductor manufacturing, design, and research.Pederson most recently served as director of government relations at the Chicago Council on Global Affairs, a bipartisan think tank.
North American Semiconductor Equipment Industry Posts August 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final July 2019 level of $2.03 billion, and is 10.5 percent lower than the August 2018 billings level of $2.23 billion.
