Brooks Instrument is celebrating its 75th year providing high-precision fluid measurement and control instrumentation.
Design
Renesas’ New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an innovative new IoT system design platform that significantly eases the prototyping of IoT systems.
White Paper: Semiconductor Innovation & Intellectual Property Rights
A new white paper from Aalbun, the World’s first Intellectual Property Platform as a Service (PaaS), highlights the big themes and issues dominating the semiconductor industry and how they and the events of the pandemic will impact on innovation and intellectual property rights in the sector going forward.
Park Systems Announces Park FX40, the Autonomous AFM with Built-in Intelligence
Park Systems, the fastest growing manufacturer of Atomic Force Microscopes (AFM) just announced Park FX40, a groundbreaking autonomous atomic force microscope, infused with innovative robotics, intelligent learning features, safety features, software and specialized add-ons.
Supplyframe Announces the Launch of DesignSense Sales Intelligence
Many people today shop for and research potential purchases online. Semiconductor and electronic component buyers are no exception.
How Chip Technology Will Decipher Brain Diseases
As part of Mission Lucidity, the brain-on-chip project tackles Parkinson’s disease. Central in this endeavor is imec’s high-density multi-electrode array (MEA) that can interface at a single-cell level. With stem cell technology that can reprogram cells, the MEA can create and tweak any relevant brain circuit to study disease mechanisms and the effects of drugs on the circuits.
Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame
Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.
Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors
Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
SmartDV Announces Support for ARINC Standards with Design and Verification IP
SmartDV Technologies today announced support of the ARINC standards with its Design and Verification IP.
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
