DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
Design
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
Gelest Inc. Names Dr. Jonathan Goff as President
Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.
Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.
SPIE, the International Society for Optics and Photonics, Announces Its 2022 Society Awards
The Awards Committee of SPIE, the international society for optics and photonics, today announced the recipients of its prestigious annual awards.
Global Fab Equipment Spending Projected to Log Record High in 2022 to Mark Third Consecutive Year of Growth, SEMI Reports
Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted today in its quarterly World Fab Forecast report.
SEMI Reschedules Industry Strategy Symposium to April 3-6, 2022
SEMI today rescheduled the Industry Strategy Symposium (ISS) 2022 from January 9-12 to April 3-6 due to a resurgence of COVID-19 cases in the United States.
Survey: Understanding the Data-Centric Era
The Data-Centric Era is here. It demands highly flexible, high bandwidth and secure infrastructure to meet the demands of highly variable, large and diverse data. Composable infrastructure provides the flexibility, bandwidth and efficiency to meet that demand.
CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced NeuPro-M, its latest generation processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads.
GaN Systems Shrinks Size and Increases Class-D Audio Capabilities with Latest Reference Design
GaN is gladly being embraced in audio, enabling companies to launch better sounding, higher-performance, smaller, and more eye-catching audio systems. And GaN Systems is making it easier to reap the benefits of GaN with the introduction of the GeN2 Amplifier and SMPS Reference Design
