To promote the local IC design startups, the Industrial Development Bureau (IDB) under the Ministry of Economic Affairs (MOEA) is supporting the Industrial Technology Research Institute (ITRI) and Arm in providing critical resources to make IC design accessible to startups in the region through a new initiative called the IC Design Platform for Startups.
Design
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
DOE Awards $30M to Secure Domestic Supply Chain of Critical Materials
The U.S. Department of Energy (DOE) today announced $30 million in funding for 13 national lab and university-led research projects to develop new technologies that will help secure the supply of critical materials that build clean energy technologies.
Silvaco Announces Resignation of CEO
Silvaco Group, Inc., a supplier of TCAD, EDA software and design IP, today announced the resignation of Babak Taheri as chief executive officer and member of the board after two years in the role.
Getting the Most Out of Your System
In an article published in the June/July issue of Semiconductor Digest, imec researchers introduce a unique simulation framework. This helps designers manage the complexity of performing cross-‘world’ optimizations – in order to enable the grand applications of the future.
New Insight into Two Widely Accepted Forms of Deep Learning
Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.
JEDEC publishes XFM Embedded and Removable Memory Device Standard
JEDEC announced the publication of JESD233: XFM Embedded and Removable Memory Device (XFMD) standard.
Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem
Intel Foundry Services will lead the first phase of the U.S. Department of Defense’s RAMP-C program to establish a domestic commercial foundry infrastructure.
IBM Unveils On-Chip Accelerated Artificial Intelligence Processor
At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.
Samsung Brings In-memory Processing Power to Wider Range of Applications
Samsung’s revelations at Hot Chips include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory.
