Supplyframe today announced that several electronic components distributors across Asia, Europe, and North America have recently adopted the company’s industry-leading DesignSense ECAD Models service.
Design
Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud
Cadence Design Systems, Inc. today announced the results of the 2021 three-way collaboration with TSMC and Microsoft, which focused on utilizing a cloud infrastructure to accelerate digital timing signoff of 10+ billion transistor designs.
CEOs of Chip, Auto, Medical Device, Tech, Telecom, Other Companies Call on Congress to Strengthen U.S. Semiconductor Research, Design, Manufacturing
The Semiconductor Industry Association (SIA) today applauded a letter sent this morning to congressional leaders by a broad coalition of 59 CEOs and senior executives urging swift action to fund the CHIPS for America Act and enact a strengthened version of the FABS Act to bolster U.S.-based semiconductor research, design, and manufacturing.
Insights Into the Trends Driving Optical Transceiver Technology
For the past 50 years, mobile technology innovations have been rolled out each decade. Mobile bandwidth requirements have evolved from voice calls and texting to ultra-high-definition (UHD) video and a variety of augmented reality/virtual reality (AR/VR) applications.
Rahul Goyal of Intel Re-Elected Board Chair of Silicon Integration Initiative
Rahul Goyal, vice president and general manager of Product and Design Ecosystem Enablement at Intel Corporation, has been re-elected to a one-year term as chairman of the board of directors of Silicon Integration Initiative, a research and development joint venture that provides design interoperability standards and solutions from silicon to systems.
SIA Applauds Bicameral Agreement on Path Forward for USICA
Senate-passed legislation includes $52 billion to fund the semiconductor manufacturing, research, and design provisions in the CHIPS for America Act.
By Keeping Ferroelectric ‘Bubbles’ Intact, Researchers Pave Way for New Devices
Special ferroelectric features offer promise for microelectronics and energy applications.
GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand
Agreement aims to build and strengthen a collaborative model to accelerate the next wave of innovation in automotive chip design.
Common Vulnerability and Exposures (CVE) Program Adds Silicon Labs as CVE Numbering Authority (CNA)
Silicon Labs (NASDAQ: SLAB) today announced it has been added as a Common Vulnerability and Exposures (CVE) Numbering Authority (CNA) by the CVE Program, allowing Silicon Labs to proactively assign identifiers to common vulnerabilities and exposures in accordance with cybersecurity standards.
Watlow’s Facility in Winona, MN Selected as Business of the Year
Watlow, a designer and manufacturer of complete thermal systems, announced that its facility in Winona, MN was selected by the Winona Chamber of Commerce as ‘Business of the Year.’
