Design

2025: AI Momentum Continues

The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.

2025: MEMS Move to 300mm

The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.

2025: Photonic Integrated Circuits – Driving Quantum Technology

Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.

2025: Optimizing Automated Test Equipment for the Era of AI and Beyond

The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.

2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems

As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.

2025: Opportunities Abound for Semiconductor Equipment

As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.

2025: Power Efficiency and Computational Flexibility in AI/ML Processors

Compression, especially after quantization, can help reduce the bandwidth and large storage required by model weights, thereby reducing power consumption.

Microchip Adds MTCH2120 to its Portfolio of Turnkey Capacitive Touch Controllers

The touch controller is designed to integrate with a comprehensive ecosystem of tools to streamline development and speed time to market.

EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure

Alliance membership enables EdgeCortix to collaborate with industry leaders and accelerate the adoption of power-efficient AI-RAN integrated systems.

Why Chiplet-Based Architecture Is the Next Frontier in Semiconductors

Traditional monolithic chip designs face mounting challenges as we continue to push the boundaries of computational power, energy efficiency, and cost-effectiveness. Enter chiplet-based architecture — an innovative solution poised to revolutionize semiconductor services and semiconductor solutions.

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