PME researchers were carrying out basic research on a magnetic topological insulator when they realized it had the potential to build optical storage devices.
Design
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
Tablet Market Finally Moves Past the Pandemic Era with Solid Growth in Q2 2024
Worldwide tablet shipments recorded year-over-year growth of 22.1% in the second quarter of 2024 (2Q24), totaling 34.4 million units, according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
SIA Applauds House Introduction of Legislation to Establish Investment Tax Credit for Semiconductor Design
SIA today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of bipartisan legislation that would expand the CHIPS and Science Act’s 25% investment tax credit to include investments in semiconductor design.
NUS Researchers Develop a Novel Technique to Fabricate Three-Dimensional Circuits for Advanced Electronics
CHARM3D paves the way for the efficient printing of free-standing 3D structures that offer high electrical conductivity, self-healing capabilities and recyclability — a boon for electronics in healthcare, communications and security.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
Pusan National University Researchers Explore the Interplay Between High-Affinity DNA and Carbon Nanotubes
Researchers demonstrate the intricate interactions between single-stranded DNA sequences and carbon nanotubes.
Chiplet Summit to Focus on New Packages and AI Applications in 2025
Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in-package (SiP).
Foam Fluidics Showcase Rice Lab’s Creative Approach to Circuit Design
Next-generation soft robotics and wearable technologies could sport foam-based fluidic circuits.
