DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
Design
A New Advancement in Photonic Chips Set to Unlock an Industry
Researchers from TMOS, the ARC Centre of Excellence for Transformative Meta-Optical Systems, have developed a new engineering approach to on-chip light sources that could lead to widespread adoption of photonic chips in consumer electronics.
AGC Establishes a New Technical Service Site in Taiwan
This center will provide technical services for chemical products focused on semiconductor and electronic materials.
IEDC to Target Semiconductor Innovation and Launch New Taiwan Office
Indiana will showcase its bold, future-focused strategy at SEMICON Taiwan and announce a new office in Taipei to further develop relationships and two-way trade opportunities.
Silicon Chip Propels 6G Communications Forward
A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.
HeterMM: Applying in-DRAM Index to Heterogeneous Memory-Based Key-Value Stores
Emerging byte-addressable storage technologies, such as NVM, provide a more cost-effective and larger-capacity alternative to DRAM, presenting new opportunities to address the high cost, limited capacity, and volatility of in-memory key-value (KV) stores.
Tech Industry Veteran Anders Storm Named Chief Executive Officer of Dirac Research AB
Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce
Cadence Design Systems, Inc. this week announced the launch of Fem.AI—an initiative to propel women and the industry towards a more equitable tech sector, with an emphasis on opportunities in AI.
Daniel Cross of Cadence Wins Si2 Pinnacle Award
Daniel Cross, senior principal solutions engineer at Cadence Design Systems, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for professional contributions to Si2’s success as a leading semiconductor research and development joint venture.
