Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.
Design
Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors
Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.
SmartDV Announces Support for ARINC Standards with Design and Verification IP
SmartDV Technologies today announced support of the ARINC standards with its Design and Verification IP.
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
Murata Launches New Chip Ferrite Beads for Automotive Applications
Murata has introduced the BLM18KN_EH series of chip ferrite beads for noise suppression in power lines at temperatures up to 175°C.
AI Chipmaker Hailo Awarded Edge AI and Vision Product of the Year
The Hailo-8, the AI processor for edge devices from AI (Artificial Intelligence) chipmaker Hailo, has been selected as winner of the 2021 Edge AI and Vision Product of the Year Awards for “Best Edge AI processor.”
Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables
Winbond Electronics Corporation and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
Meghan Biery Joins Semiconductor Industry Association as Director of Global Technology and Security Policy
Biery most recently served as senior national security policy advisor at the Commerce Department’s Bureau of Industry and Security.
Kurt Sievers, President and CEO of NXP Semiconductors, Joins GSA’s Board of Directors
The Global Semiconductor Alliance (GSA) Board of Directors welcomes Kurt Sievers, President and CEO of NXP Semiconductors (NXP).
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the April/May issue…
