Under the award, Everspin will provide a plan to mitigate risks to its MRAM manufacturing supply chain.
Design
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
MULTI-DOF Technology from HEIDENHAIN Gives Hybrid Bonding a Boost
While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
MetroLED Launches Pixel LED Displays to Expand Growing LED Display Product Line
MetroLED announced the expansion of Pixel LED Displays, a division established in 2010, dedicated to enhancing its successful LED display product line.
New Technique Prints Metal Oxide Thin Film Circuits at Room Temp
Researchers have demonstrated a technique for printing thin metal oxide films at room temperature, and have used the technique to create transparent, flexible circuits that are both robust and able to function at high temperatures.
AI Use Cases in Semiconductor Manufacturing and the Theory of Adjacent Possible
Keynote speaker at SEMI Pac NW event discussed specific AI use case examples in manufacturing before finishing with TAP and a Cambrian explosion.
SiFive Announces New High-Performance RISC-V Datacenter Processor for Demanding AI Workloads
Today, SiFive, Inc. announced its new SiFive Performance P870-D datacenter processor to meet customer requirements for highly parallelizable infrastructure workloads including video streaming, storage, and web appliances.
IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts.
Tachyum Builds Last FPGA Prototypes Batch Ahead of Tape-Out
Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.
