A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
Design
HKU Engineering Researchers Develop Revolutionary Diamond Fabrication Technology
A research team led by Professor Zhiqin Chu, Associate Professor in the Department of Electrical & Electronic Engineering, and Professor Yuan Lin, Professor in the Department of Mechanical Engineering, Faculty of Engineering at the University of Hong Kong (HKU), has developed a groundbreaking method for massively producing ultrathin and ultra-flexible diamond membranes.
Micon Global and Silvaco Announce New Partnership
Micon Global announced a strategic sales partnership with Silvaco, a provider of software solutions for semiconductor and photonics design, including TCAD, EDA software, and SIP solutions.
Solving the Skilled Tech Talent Gap in the Semiconductor Industry
By implementing strategic workforce management and partnering with experienced experts, semiconductor companies can effectively navigate the talent shortage, build a sustainable workforce, and position themselves for long-term success
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
Working Group Named Targeting Billions in CHIPS and Science Act Funding for Washington State
Commerce Department announces first working group members to develop statewide response to historic federal funding opportunities, slates first meeting Dec. 17.
How Silicon Carbide Semiconductors Are Conquering E-mobility
Bosch has tailored its semiconductor development to the demands of the automotive industry.
Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a provider of silicon to systems design solutions, to enable a solution that will shorten design cycle time.
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
Tackling Network-on-Chip (NoC) Scaling Challenges with a System-technology Co-optimization Approach
Co-integration of NoC routing channels alongside the backside power delivery network: a scalable and cost-effective approach.
