Olympus, a leading manufacturer of industrial microscopes, is improving the efficiency of nonmetallic inclusion analysis for steel manufacturers who use OLYMPUS Stream image analysis software.
Design
SEMI Virtual Summit Focuses on Microtechnology-Enabled Solutions to Healthcare Challenges
The latest healthtech innovations driven by microelectronics will be presented at the SEMI Virtual Healthtech Summit, Europe’s first online event to explore the critical role of semiconductors in solving the world’s most pressing healthcare challenges including COVID-19. Registration is open for the July 16, 2020, summit.
Call for SEMICON West 2020 “Best of West” Award Applications
SEMI today began accepting SEMICON West 2020 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
Samsung Provides One-Stop Foundry Design Environment with the Launch of ‘SAFE Cloud Design Platform’
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the launch of ‘Samsung Advanced Foundry Ecosystem (SAFE) Cloud Design Platform (CDP)’ for fabless customers, in collaboration with Rescale, a leader in high performance computing (HPC) applications in the cloud.
Seoul Viosys’ Violeds, the World’s First UV LED Technology Proven to Sterilize New Coronaviruses, Has Been Adopted by Gree
Seoul Viosys (KOSDAQ: 092190), a leading compound semiconductor solution provider, announced that its ultraviolet LED Violeds technology – the world’s first UV LED technology proven to sterilize new coronaviruses – has been adopted for the new “Fresh Air” brand of air conditioners produced by Gree Electric Appliances Inc. (Gree), the largest Chinese manufacturer of air conditioners.
QuickLogic Announces Open Reconfigurable Computing Initiative
QuickLogic Corporation today announced its ground breaking QORC (QuickLogic Open Reconfigurable Computing) initiative, making it the first programmable logic vendor to actively embrace a fully open source suite of development tools for its FPGA devices and eFPGA technology.
2020 VLSI Symposia: Intel Showcases Intelligent Edge and Energy-Efficient Performance Research
This week at the 2020 Symposia on VLSI Technology and Circuits, Intel will present a body of research and technical perspectives on the computing transformation driven by data that is increasingly distributed across the core, edge and endpoints.
Dow Introduces Easy-to-Dispense Gap Filler with Strong Thermal Conductivity and Slump Resistance for Efficient Assembly
Dow introduced today new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.
Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact
Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.
