Design

ROHM’s New N-Channel MOSFETs Offer High Mounting Reliability in Automotive Applications

ROHM Semiconductor today announced new N-channel MOSFETs featuring low ON-resistance ideal for a variety of automotive applications, including motors for doors and seat positioning, as well as LED headlights.

REC Silicon and Sila Sign Long-Term Silane Supply Agreement

Sila Nanotechnologies, Inc. today announced a multi-year supply agreement with a wholly owned subsidiary of REC Silicon ASA (“REC”), an innovator in solar-grade silicon and silicon materials.

Advanced Energy Opens Design and Service Center in the Greater Boston Area

New facility will develop and support advanced power technologies for plasma processes, medical and high-voltage industrial applications.

NORDTECH R&D Projects Selected to Receive $30M in Federal Awards from U.S. Department of Defense

These projects are set to receive a total of more than $30 million in the technical areas of quantum and commercial leap ahead technologies.

SiFive Highlights Key Inflection Points Driving RISC-V Adoption for AI and Introduces Intelligence XM Series for AI Workload Acceleration

Today, SiFive, Inc. announced the SiFive Intelligence XM Series designed for accelerating high performance AI workloads.

Student Analog Chip Designs Come to Life Through New Collaboration with Texas Instruments

The Georgia Tech School of Electrical and Computer Engineering (ECE) is collaborating with Texas Instruments (TI) to launch strategic educational opportunities aimed at providing students access to industry-grade analog chip design, fabrication, and testing processes.

Intel and AWS Expand Strategic Collaboration

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel.

Joachim Kunkel Joins Arteris Board of Directors

Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Joachim Kunkel will join its Board of Directors.

Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.

Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award

Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). 

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