Design

ISS: 2020 Outlook for EUV

At SEMI’s 2020 Industry Strategy Symposium (ISS), held January 12-15th at Half Moon Bay in California, Marco Pieters, Vice President, EUV Product Marketing, ASML provided a status report on EUV’s acceptance in high volume manufacturing and an update on progress toward the company’s next-gen high NA tool.

ISS: 2020 Outlook on Automotive Electronics

At SEMI’s 2020 Industry Strategy Symposium (ISS), held January 12-15th at Half Moon Bay in California, Ken Washington, CTO, Ford Motor Company, who described a vision for cars of the future and their requirements when it comes to connectivity and compute power.

ISS: The 2020 Outlook for Consumer Electronics

At SEMI’s 2020 Industry Strategy Symposium (ISS), held January 12-15th at Half Moon Bay in California, Shawn DuBravac, CEO, Avrio Institute, gave his insights on major trends in consumer electronics, with specific examples from the recent Consumer Electronics Show (CES).

Nano-Thin Flexible Touchscreens Could Be Printed Like Newspaper

Researchers have developed an ultra-thin and ultra-flexible electronic material that could be printed and rolled out like newspaper, for the touchscreens of the future. The touch-responsive technology is 100 times thinner than existing touchscreen materials and so pliable it can be rolled up like a tube. To create the new conductive sheet, an RMIT University-led team used a thin film common in cell phone touchscreens and shrunk it from 3D to 2D, using liquid metal chemistry.

Kneron Raises Additional $40M, Brings Total Series A To $73M

Kneron, Inc., a leading on-device edge artificial intelligence (AI) company based in San Diego, California, announces it has raised an additional $40M dollars in funding. Horizons Ventures, Hong Kong businessman Li Ka-Shing’s venture capital firm, is the lead investor of this round and has invested in previous rounds. Kneron previously raised $33 million in funding from Horizons Ventures, Alibaba Entrepreneurs Fund, CDIB, Himax Technologies, Inc, Qualcomm, Thundersoft, and Sequoia Capital.

MoDeCH Incorporated Launches eCommerce Website To Supply And Support Downloadable SPICE Models For Analog Circuit Designers

MoDeCH Inc., a company founded in 2002 and dedicated to delivering modeling services to PCB and semiconductor designers, today launched its English language ecommerce site, “Model On! Search.” Previously available only in Japan, Model On! was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets.

USMCA Approval Strengthens U.S. Technology and Trade Leadership

The Semiconductor Industry Association (SIA) today applauded Senate approval of the U.S.-Mexico-Canada Agreement (USMCA), which passed with strong bipartisan support earlier today. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor company sales. “Congressional approval of the USMCA is a major win for free trade and America’s global leadership in semiconductors and the technologies they enable,” said John Neuffer, SIA president and CEO. “The agreement will help ensure that more products researched, designed, and made in America – including semiconductors – can flow to customers around the world. We applaud the Administration and Congress for negotiating and approving this landmark agreement.”

Bose and HERE Fuel AR Experience Innovation By Combining Location and Audio Technologies

HERE Technologies, a global leader in mapping and location platform services, today announced a collaboration with Bose Corporation to jointly enable their respective developer communities to deploy augmented reality (AR) location applications and services. This collaboration gives HERE developers access to the Bose AR platform and spatial-audio capabilities, and extends the HERE platform, positioning and mobile SDK location technologies to developers building audio AR applications and experiences.

AI Chip Company Syntiant Joins Qualcomm Extension Program

Syntiant, an AI chip company providing custom always-on voice solutions at the edge, today announced that it is now a member of the Qualcomm® Extension Program, offering OEMs and ODMs accelerated integration of its ultra-low-power neural network technology with Qualcomm® Bluetooth audio platforms and SOCs. With support from the Qualcomm Extension Program, Syntiant plans to deliver a touch-free, cloud- free, machine learning voice solution for always-on speech applications in battery-powered devices, such as Bluetooth-enabled earbuds and hearable devices.

Murata and Google Team to Develop World’s Smallest AI Module With Coral Intelligence

Murata Electronics Americas announced today that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint. The solution overcomes some of the most pressing challenges in implementing AI solutions by delivering superior noise suppression and simplifying printed circuit board design in a smaller footprint. Miniaturization is key as all board space must be optimized to achieve highly robust functionality in space constrained operations. The result of this collaboration is a solution that speeds up the algorithmic calculations required to execute AI.

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