A team of researchers based in Manchester, the Netherlands, Singapore, Spain, Switzerland and the USA has published a new review on a field of computer device development known as spintronics, which could see graphene used as building block for next-generation electronics.
Design
Merck KGaA, Darmstadt, Germany, Announces Go-Live of Newly Integrated Performance Materials Organization
Merck KGaA, Darmstadt, Germany, a leading science and technology company, today announced an important milestone in its Bright Future transformation program for its Performance Materials business.
Imagination Announces Next-Generation IEEE 802.11ax/Wi-Fi 6 IP for Low-Power Applications
Imagination Technologies announces the launch of IMG iEW400, its latest IP based on Imagination’s Ensigma Wi-Fi technology. iEW400 delivers integrated RF and baseband, designed for low-power and battery-powered applications such as the internet of things (IoT), wearables and hearables.
Tech Visionaries to Explore the Future of Innovation at Virtual SEMICON West 2020
Keynotes for SEMI’s 50th anniversary to highlight technology’s potential to improve prosperity worldwide.
Texas Instruments Maintains Firm Grip As World’s Top Analog IC Supplier
TI’s 2019 analog marketshare grew to 19% and ST climbed to fourth place as the top-10 suppliers collectively accounted for 62% of total analog sales.
Synopsys’ Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA
Synopsys, Inc. (Nasdaq: SNPS) today announced that its silicon-proven DesignWare® DDR5/4 PHY IP will be used by Mellanox, NVIDIA’s networking business unit, to address evolving memory requirements in its InfiniBand networking chips targeting high-performance computing and artificial intelligence (AI) applications.
CyrusOne Deploys Liquid to Chip Cooling Solution
CyrusOne Inc. (NASDAQ: CONE), a global data center real estate investment trust (REIT), today announced the use of the latest Internet Computer Concepts (ICC) and Asetek technologies for cooling design solutions across campuses.
Ventev Partners with Cisco for IoT Design Program
Ventev, the manufacturing unit of TESSCO Technologies, Inc. (Nasdaq: TESS), recently announced its selection as a partner in the Cisco Internet of Things Design-In Program. The program offers customers integrated power solutions, featuring Cisco industrial IoT networking and data solution products.
Lattice and Etron Deliver Small, Low Power Reference Design for Edge AI and Video Processing Applications
The reference design reduces power consumption, overall design size, and data latency by allowing developers to store data used in AI and smart vision applications locally instead of using larger, external memory cards.
SEMICON Southeast Asia 2020 Goes Virtual to Highlight Industry Innovation and Growth Opportunities
SEMICON Southeast Asia 2020 is going virtual as the region’s premiere global electronics manufacturing supply chain exposition and conference continues its rich tradition of gathering industry experts from around the world for critical insights into the semiconductor ecosystem, new business opportunities and collaboration. SEMICON SEA 2020 registration is now open.
