Design

New Operational Technology Cyber Security Alliance Launches to Deliver Comprehensive Cyber Security Guidelines for Operational Technology

Cyber-attacks on critical and industrial infrastructure are on the rise, impacting operational reliability and business risk across all industries, including utilities, manufacturing and oil & gas. Threats to operational technology (OT) – the hardware and software dedicated to monitoring and controlling physical devices such as valves, pumps, etc. – can disrupt operations, negatively impact productivity, cause ecological damage and compromise human safety. To help mitigate this risk, a new global alliance focused on cyber security launched today. The Operational Technology Cyber Security Alliance (OTCSA) was established to help companies address the OT security challenges that continue to put operations, and consequently, business at risk.

UCI Scientists Reveal Mechanism of Electron Charge Exchange in Molecules

Researchers at the University of California, Irvine have developed a new scanning transmission electron microscopy method that enables visualization of the electric charge density of materials at sub-angstrom resolution. With this technique, the UCI scientists were able to observe electron distribution between atoms and molecules and uncover clues to the origins of ferroelectricity, the capacity of certain crystals to possess spontaneous electric polarization that can be switched by the application of an electric field. The research, which is highlighted in a study published today in Nature, also revealed the mechanism of charge transfer between two materials.

Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm “Hercules” Processor on 5LPE Process

Synopsys, Inc. today announced that Synopsys, Arm, and Samsung have actively collaborated on solutions to enable early adoption of the next-generation Arm-based processor. Design-ready solutions are based on the artificial intelligence (AI)-enhanced, cloud-ready Fusion Design Platform from Synopsys, along with Arm Artisan Physical IP and POP IP for Samsung Foundry’s advanced 5LPE process. These solutions will accelerate development of the next wave of semiconductor system-on-chips (SoCs), including designs for high-performance computing (HPC), automotive, 5G, and AI market segments. The collaboration will help customers optimize power, performance, and area (PPA), and achieve faster time-to-market while providing full-flow quality-of-results (QoR) and time-to-results (TTR).

Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors

Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.

2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies

“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.

The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.

New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for MIPI-based Embedded Vision Systems

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on panel display performance, and flexible on-device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications.

Aldec’s Focus for Arm TechCon is on Deep Neural Network and Machine Learning Application Development

Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for ASIC and FPGA designs, will be exhibiting at Arm TechCon (October 8-10, San Jose, California, USA) and demonstrating solutions that stand to aid greatly in the development of Deep Neural Network (DNN) and Machine Learning (ML) applications.

SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World

Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.

A Deep Dive into AI Chip Arithmetic Engines

Tesla’s autopilot chip executes 72-trillion additions and multiplications per second: It better get the math right

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