Atmosic™ Technologies, innovator of ultra-low-power wireless for the Internet of Things (IoT), today announced the completion of its Series B funding, raising $28.5 million. This investment, led by Sutter Hill Ventures – along with investments from Clear Ventures, Walden International, Dolby Family Ventures, and Arden Road Investments – brings the total amount of funding raised to $49.5 million since the company’s inception in 2016. This new round of funding will be used to deploy Atmosic’s award-winning M2 and M3 series Bluetooth 5 system-on-a-chip (SoC) solutions into commercial products in early 2020. The funding will also support the company’s continued laser focus on R&D to develop its next generation solutions, and Atmosic’s efforts to scale the business as the supplier of the lowest-power consumption wireless technologies for the IoT.
Design
ON Semiconductor to Demonstrate Intelligent IoT Technologies Including Advanced Audio Processing at CES 2020
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will showcase a wide range of innovative technologies for smart homes, connected buildings and personal IoT at CES 2020. The rise of voice control and Voice User Interfaces (VUI) has made audio processing critical to the success of a wide range of building automation and household applications. ON Semiconductor will feature two demonstrations using its LC823455, which provides key features for portable sound solutions and support for VUI. A Strata-enabled stereo speaker capable of streaming music over Bluetooth® will show various advanced audio functionalities including touch sensor-based volume control and voice commands. The LC823455 will also be featured in a cloud-based VUI demonstration for communication with IoT edge-nodes applications.
Immersion Appoints Aaron Akerman as Chief Financial Officer
Immersion Corporation (Nasdaq: IMMR), the leading developer and licensor of touch feedback technology, today announced the appointment of Aaron Akerman as the company’s Chief Financial Officer (CFO). He will begin his employment on January 13, 2020. Akerman joins Immersion from Hypertec Group, where he was its CFO. He brings over 15 years of leadership experience in corporate finance, accounting, treasury, financial and strategic planning, and operations. Aaron will join Immersion’s executive team and manage the company’s finance organization.
Mobiveil’s PCI Express 4.0 Endpoint Controller Passes PCI-SIG Gold and Interoperability Testing
Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced that its GPEX™ PCI Express® (PCIe®) 4.0 Endpoint Controller passed PCI-SIG® Gold and Interoperability testing. To achieve compliance, the Mobiveil GPEX IP passed protocol, electrical and interoperability testing for the PCIe 4.0 specification that reaches 16 gigatransfers per second (GT/s). Its highly flexible and configurable IP design targets endpoint or root complex type devices, as well as switches and bridge implementations. The controller IP architecture is tailored to optimize link utilization, latency, reliability, power consumption and reduce the silicon footprint.
FLEX and MSTC 2020 to Showcase Flexible Hybrid Electronics, MEMS and Sensors Innovations for More Personalized Applications
Flexible hybrid electronics breakthroughs are driving the next wave of smart MEMS and sensing solutions for more personalized, portable electronics, setting the stage for the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) Feb. 24-27, 2020. Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group, FLEX and MSTC will gather more than 100 global experts for market and technical presentations, tech courses, and more than 50 exhibit opportunities for connecting with industry visionaries at the DoubleTree by Hilton Hotel in San Jose, Calif. Registration is now open.
MIRISE Technologies to be Launched to Develop Semiconductors in Effort to Achieve Safe and Comfortable Future Global Mobility Society
DENSO Corporation and Toyota Motor Corporation today announced that they have named the joint venture to be established in April 2020 MIRISE Technologies (“MIRISE”). The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors. It also conveys “mirai” (a Japanese word for “future”) and “rise.” Yoshifumi Kato has been appointed President and Representative Director of the new company.
Aldec’s New FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a powerful, versatile and time- saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning. The solution includes an Aldec TySOM embedded prototyping board, up to eight high-bandwidth, low- latency FMC-NVMe daughter cards, and a reference design (including source files and binaries) allowing engineers to fast-track their projects.
Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES
Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the industry’s first USB-C® multiprotocol retimer solution with USB4™ support at CES January 7-10 in Las Vegas, Nev. The prototype will showcase the benefits of Kandou’s Matterhorn USB Type-C® 40 GB/s multiprotocol switch and bidirectional bit-level retimer solution for faster video processing and data transfer connections to drive next-generation USB-enabled devices. It follows the USB Implementers Forum (USB-IF) specification for USB4 and targets a wide range of applications that include mobile, tablet and desktop PCs, active cables, monitors, docking stations, external hard solid-state drives, and gaming consoles.
Properties of Graphene Change Due to Water And Oxygen
The research team consisted of Professor Sunmin Ryu, Kwanghee Park, and Haneul Kang, affiliated with Department of Chemistry, POSTECH, discovered that the doping of two-dimensional materials with influx of charges from outside in the air is by an electrochemical reaction driven by the redox couples of water and oxygen molecules. Using real-time photoluminescence imaging, they observed the electrochemical redox reaction between tungsten disulfide and oxygen/water in the air. According to their study¸ the redox reaction can control the physical properties of two-dimensional materials which can be applied to bendable imaging element, high-speed transistor, next generation battery, ultralight material and other two-dimensional semiconductor applications.
Intel Completes Sale of Smartphone Modem Business to Apple
Intel Corporation today announced it has completed the sale of the majority of its smartphone modem business to Apple. This transaction, valued at $1 billion, was announced on July 25, 2019. As previously disclosed, this transaction enables Intel to focus on developing technology for 5G networks while retaining the option to develop modems for non-smartphone applications, such as PCs, internet of things devices and autonomous vehicles.
