The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Design
New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for MIPI-based Embedded Vision Systems
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on panel display performance, and flexible on-device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications.
Aldec’s Focus for Arm TechCon is on Deep Neural Network and Machine Learning Application Development
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for ASIC and FPGA designs, will be exhibiting at Arm TechCon (October 8-10, San Jose, California, USA) and demonstrating solutions that stand to aid greatly in the development of Deep Neural Network (DNN) and Machine Learning (ML) applications.
SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World
Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
A Deep Dive into AI Chip Arithmetic Engines
Tesla’s autopilot chip executes 72-trillion additions and multiplications per second: It better get the math right
Tachyum Joins Intel, AMD, and nVidia With New Headquarters in Santa Clara
Tachyum, a semiconductor startup and developer of the world’s first Universal Processor platform, today announced the opening of its new, larger corporate headquarters in Santa Clara to better accommodate the rapidly growing number of customers, partners, vendors and its growing personnel ranks. The new offices are located at 2520 Mission College Blvd, Suite 201, Santa Clara CA 95054. Tachyum’s new facilities will better enable the company to finish development, start marketing and selling its disruptive products that tackle the most pressing global issues in data centers, AI, telecommunications, edge computing and mobility today.
Erik Pederson Joins Semiconductor Industry Association as Government Affairs Director
The Semiconductor Industry Association (SIA) announced Erik Pederson has joined the association as government affairs director. In this role, Pederson will work with Congress, the White House, and federal agencies to advance the semiconductor industry’s policy priorities, particularly those related to trade, export control, and tax. SIA represents U.S. leadership in semiconductor manufacturing, design, and research.Pederson most recently served as director of government relations at the Chicago Council on Global Affairs, a bipartisan think tank.
North American Semiconductor Equipment Industry Posts August 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final July 2019 level of $2.03 billion, and is 10.5 percent lower than the August 2018 billings level of $2.23 billion.
Building Stronger, Better Designs with DTCO CMP Modeling and Simulation
Predicting CMP damage has always been a part of the manufacturing process, but in a Design-technology co-optimization (DTCO) flow, foundries and EDA companies can work together to automate CMP model building and simulation.
Bayesian Machine Learning Enables a Virtual Defect Pareto Through Software Simulation
A Failure Mechanism Pareto can be derived through software by applying Bayesian Machine Learning to diagnostic fault simulations.
