A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.
Design
HeterMM: Applying in-DRAM Index to Heterogeneous Memory-Based Key-Value Stores
Emerging byte-addressable storage technologies, such as NVM, provide a more cost-effective and larger-capacity alternative to DRAM, presenting new opportunities to address the high cost, limited capacity, and volatility of in-memory key-value (KV) stores.
Tech Industry Veteran Anders Storm Named Chief Executive Officer of Dirac Research AB
Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce
Cadence Design Systems, Inc. this week announced the launch of Fem.AI—an initiative to propel women and the industry towards a more equitable tech sector, with an emphasis on opportunities in AI.
Daniel Cross of Cadence Wins Si2 Pinnacle Award
Daniel Cross, senior principal solutions engineer at Cadence Design Systems, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for professional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing
Under the award, Everspin will provide a plan to mitigate risks to its MRAM manufacturing supply chain.
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
MULTI-DOF Technology from HEIDENHAIN Gives Hybrid Bonding a Boost
While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
