Flexible hybrid electronics breakthroughs are driving the next wave of smart MEMS and sensing solutions for more personalized, portable electronics, setting the stage for the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) Feb. 24-27, 2020. Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group, FLEX and MSTC will gather more than 100 global experts for market and technical presentations, tech courses, and more than 50 exhibit opportunities for connecting with industry visionaries at the DoubleTree by Hilton Hotel in San Jose, Calif. Registration is now open.
Design
MIRISE Technologies to be Launched to Develop Semiconductors in Effort to Achieve Safe and Comfortable Future Global Mobility Society
DENSO Corporation and Toyota Motor Corporation today announced that they have named the joint venture to be established in April 2020 MIRISE Technologies (“MIRISE”). The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors. It also conveys “mirai” (a Japanese word for “future”) and “rise.” Yoshifumi Kato has been appointed President and Representative Director of the new company.
Aldec’s New FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a powerful, versatile and time- saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning. The solution includes an Aldec TySOM embedded prototyping board, up to eight high-bandwidth, low- latency FMC-NVMe daughter cards, and a reference design (including source files and binaries) allowing engineers to fast-track their projects.
Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES
Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the industry’s first USB-C® multiprotocol retimer solution with USB4™ support at CES January 7-10 in Las Vegas, Nev. The prototype will showcase the benefits of Kandou’s Matterhorn USB Type-C® 40 GB/s multiprotocol switch and bidirectional bit-level retimer solution for faster video processing and data transfer connections to drive next-generation USB-enabled devices. It follows the USB Implementers Forum (USB-IF) specification for USB4 and targets a wide range of applications that include mobile, tablet and desktop PCs, active cables, monitors, docking stations, external hard solid-state drives, and gaming consoles.
Properties of Graphene Change Due to Water And Oxygen
The research team consisted of Professor Sunmin Ryu, Kwanghee Park, and Haneul Kang, affiliated with Department of Chemistry, POSTECH, discovered that the doping of two-dimensional materials with influx of charges from outside in the air is by an electrochemical reaction driven by the redox couples of water and oxygen molecules. Using real-time photoluminescence imaging, they observed the electrochemical redox reaction between tungsten disulfide and oxygen/water in the air. According to their study¸ the redox reaction can control the physical properties of two-dimensional materials which can be applied to bendable imaging element, high-speed transistor, next generation battery, ultralight material and other two-dimensional semiconductor applications.
Intel Completes Sale of Smartphone Modem Business to Apple
Intel Corporation today announced it has completed the sale of the majority of its smartphone modem business to Apple. This transaction, valued at $1 billion, was announced on July 25, 2019. As previously disclosed, this transaction enables Intel to focus on developing technology for 5G networks while retaining the option to develop modems for non-smartphone applications, such as PCs, internet of things devices and autonomous vehicles.
Industry Strategy Symposium 2020 to Highlight Data-Driven Innovation and Growth
SEMI announced today that Industry Strategy Symposium (ISS) 2020 will take place January 12-15 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Data Driven Innovation and Growth. ISS is the year’s first executive check-in, offering perspectives from leading analysts, researchers, economists, and technologists on forces impacting the semiconductor industry. The annual symposium provides insights into growth opportunities and industry intelligence to help inform company business plans and forecasts based on current market conditions. Registration is now open.
SEMICON Europa Opens with SMART Mobility, MedTech, Design and Talent in Spotlight
SEMICON Europa, Europe’s largest event connecting the entire electronics design and manufacturing supply chain – from innovation to applications – opens today in strategic co-location with productronica at Messe München, in Munich, Germany. Themed Semiconductors Drive Smart, SEMICON Europa 2019 – Nov. 12-15 – highlights the vital importance of European sectors and ecosystems in propelling the semiconductor manufacturing industry and the broader electronics design and manufacturing supply chain worldwide.
China GDP and PMI Contraction A Risk Factor For Global Economy
IC Insights recently released its October Update to The McClean Report 2019. Part of the update reviewed U.S. and China GDP and PMI trends in light of the current trade friction between the two nations.
Renesas Expands Access to Portfolio of Leading-Edge IP Licenses
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced expanded access to its highly sought portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customer requirements in a rapidly changing industry. Starting today, customers will have access to IPs such as advanced 7nm (nanometer) SRAM and TCAM, and leading-edge standard Ethernet time-sensitive networking (TSN) IP. Furthermore, Renesas is working on providing a system IP which includes PIM (processing in memory), which attracted attention as an AI accelerator, presented in a conference paper in June 2019.
