Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Electronics has certified the Synopsys Fusion Design Platform™ for Samsung’s 5-nanometer (nm) Low-Power Early (LPE) process with Extreme Ultraviolet (EUV) lithography technology. The AI-enhanced, cloud-ready Fusion Design Platform provides unprecedented full-flow quality-of-results (QoR) and time-to-results (TTR), enabling the full entitled performance and low power delivered by Samsung’s 5LPE process technology to accelerate the next wave of semiconductor designs, including high-performance computing (HPC), automotive, 5G, and artificial…
Design
Big Energy Savings For Tiny Machines
Inside all of us are trillions of tiny molecular nanomachines that perform a variety of tasks necessary to keep us alive. In a ground-breaking study, a team led by SFU physics professor David Sivak demonstrated for the first time a strategy for manipulating these machines to maximize efficiency and conserve energy. The breakthrough could have ramifications across a number of fields, including creating more efficient computer chips and solar cells…
Call For SEMICON WEST 2019 “Best Of West” Award Applications
SEMI is accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability. The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form. Best of West award winners will be announced July 10 at SEMICON West 2019, July…
CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
Leti, a research institute of CEA Tech, recently announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit. The approach fabricates elementary units of all-in-one red, green, blue (RGB) microLEDs on a CMOS driving circuit, and transfers the devices to a simple receiving substrate. The units are fabricated with a full semiconductor, wafer-scale approach. “This new process, in the proof-of-concept…
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI AG, a leading German manufacturer of luxury vehicles, has become the first automotive OEM to join SEMI. SEMI membership will give Audi access to SEMI core competencies in developing international standards and harmonizing technology roadmaps and enable the automaker to leverage the global SEMI platform to promote industry alignment across supply-chain segments. Audi is a…
Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets
Silvaco Inc., a supplier of EDA software and design IP, announced that the semiconductor design IP of Samsung Foundry is now marketed, licensed and supported through Silvaco Inc. The addition of Samsung production-proven design IP complements Silvaco’s existing SIPware™ IP products and solutions—embedded processors, wired interfaces, bus fabrics, peripheral controllers, cores for automotive, consumer and IoT/sensor applications. The initial offering of hard design IP is for the 14nm process node and is…
IP Royalties Out – Commoditization in?
John Blyler interview Nikos Zervas, CEO of CAST IP, on the future of IP Royalties. Are they a thing of the past?
Semiconductor IP Cost and Security in the Internet-of-Things (IOT)
“IP Cost and Security in IOT” – Interview (Pt. 1) with Nikos Zervas, CEO of CAST IP, at IOT DevCon 2017.
The Business versus the Technical side of Semiconductor IP
What are the business vs technical challenges of semi IP for price-sensitive, low-volume but still…
