May sales increase on a year-to-year basis by largest percentage since April 2022; worldwide chip sales increase 4.1% month-to-month.
Design
What’s in the July Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up an issue in print at SEMICON West from the publication bins or from our booth, #248.
New SEMI Governing Council for Smart MedTech Initiative to Connect Semiconductor and Life Science Communities
SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced the formation of a governing council for its Smart MedTech Initiative that will guide the initiative in its vision to revolutionize global healthcare through innovation, democratization, and pioneering advances in preventative care.
Faraday Joins Intel Foundry Accelerator Design Services Alliance
Faraday Technology Corporation announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicles.
Self-Assembling, Highly Conductive Sensors Could Improve Wearable Devices
To advance soft robotics, skin-integrated electronics and biomedical devices, researchers at Penn State have developed a 3D-printed material that is soft and stretchable — traits needed for matching the properties of tissues and organs — and that self-assembles.
Lightmatter Announces NVIDIA Executive Simona Jankowski as Chief Financial Officer
Lightmatter today announced the appointment of Simona Jankowski as Chief Financial Officer (CFO).
Altair Signs Agreement to Acquire Metrics Design Automation Inc.
Altair announced it has entered into a definitive agreement to acquire all of the outstanding capital stock of Metrics Design Automation Inc.
Lattice Introduces New Secure Control FPGA Family
Lattice Semiconductor, the low power programmable leader, today expanded its leadership in security-focused hardware and software with the launch of two new solutions to address customer challenges around increasing threats to system security.
Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.
