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Design
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
Synopsys, Inc. today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
Xpeedic Releases EDA 2024 Platforms
Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation.
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NoC) and Physical Layer (PHY) interconnect IP solution.
Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry
Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.
Breker Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
Breker Verification Systems, whose product portfolio solves challenges across the functional and system verification process for large, complex semiconductors, today unwrapped its RISC-V CoreAssurance and SoCReady SystemVIP providing a complete range of automated tests for the entire RISC-V core and SoC verification stack.
Quantum Leap Solutions Named Authorized Reseller for Synopsys for North America
Quantum Leap Solutions announced its recent appointment as an authorized North American reseller for Synopsys’ comprehensive suite of EDA, semiconductor IP, and cloud solutions.
Primarius to Feature Fast, Accurate Modeling, Characterization, Simulation Solutions at 61st Design Automation Conference
Primarius Technologies will demonstrate its entire portfolio of EDA toolchain and one-stop design enablement solutions that integrate advanced parallelization technologies with industry-proven modeling and simulation engines at the 61st Design Automation Conference (DAC) June 24-26 at Moscone West in San Francisco.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
IDTechEx Summarizes the Emerging Adoption and Future Trends of SiC and GaN in EVs
In 2008, the commercialization of the silicon carbide (SiC) MOSFET marked a major turning point for the power semiconductor market, representing its first significant development in decades.
