Design

SIA Applauds House Introduction of Legislation to Establish Investment Tax Credit for Semiconductor Design

SIA today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of bipartisan legislation that would expand the CHIPS and Science Act’s 25% investment tax credit to include investments in semiconductor design.

NUS Researchers Develop a Novel Technique to Fabricate Three-Dimensional Circuits for Advanced Electronics

CHARM3D paves the way for the efficient printing of free-standing 3D structures that offer high electrical conductivity, self-healing capabilities and recyclability — a boon for electronics in healthcare, communications and security.

Analog Devices and Flagship Pioneering Announce Strategic Partnership

Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.

IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees

2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.

Pusan National University Researchers Explore the Interplay Between High-Affinity DNA and Carbon Nanotubes

Researchers demonstrate the intricate interactions between single-stranded DNA sequences and carbon nanotubes.

Chiplet Summit to Focus on New Packages and AI Applications in 2025

Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in-package (SiP).

Foam Fluidics Showcase Rice Lab’s Creative Approach to Circuit Design

Next-generation soft robotics and wearable technologies could sport foam-based fluidic circuits.

Micron Introduces the World’s Fastest Data Center SSD

Micron Technology, Inc. today announced availability of the Micron 9550 NVMe SSD – the world’s fastest data center SSD and industry leader in AI workload performance and power efficiency.

Imec's CMOS 2.0 has the same ‘look and feel’ as a classical CMOS platform.
System-Level Simulations, Sub-System Digital Twins, 2.5D Heterogeneous Integration, UCIe and CMOS 2.0

Chip design simulation remains an important tool, but manufacturing and supply chain simulators are equally critical – e.g., digital twins and chiplets. Die hardware integration security looks to be the new threat target for modern systems, and CMOS 2.0 may make the challenge even more significant.

Advanced Energy Unveiled New Smart Monitoring and Digital Control Capabilities for AC-DC High Power Supplies

Advanced Energy has unveiled a new hardware accessory for its ultra-efficient, high-power suppliers. AE’s PowerPro Dongle unlocks real-time powerful monitoring, control and diagnostics capabilities for designers.

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