With multiple investments announced by players, the Power SiC wafer front-end equipment market will peak at $5 billion in 2026. Besides the strong growth in the tool market, there are some concerns about future over-capacity and manufacturing challenges for technology transition.
Design
Silicon Photonics Light the Way Toward Large-Scale Applications in Quantum Information
Silicon-based frequency-entangled qubits enable secure quantum information distribution across a five-user quantum network without the need for trusted nodes.
Inorganic Ventures acquires PURE Analytical Laboratories
IV Labs Inc, the parent company of Inorganic Ventures, has acquired PURE Analytical Laboratories in a move to produce materials with higher purities than currently available and to create new, high-purity materials for emerging applications from semiconductors and computing to pharmaceuticals and diagnostic equipment.
Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 14.4% to $4,521.6 million in the first quarter of 2024 from the $3,951.1 million registered in the first quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Kaman Measuring Highlights High Precision Displacement Sensors for Extreme Environments
The Measuring Division of Kaman Precision Products, Inc. highlights the availability of high precision displacement sensors for extreme environments such as power generation including nuclear and aerospace propulsion, materials research and development, with operating temperatures from -320°F to +1000°F (+1200°F short term) at pressures up to 5000 psi.
Si2 Announces Recipients of Annual Power of Partnerships Award
Silicon Integration Initiative has announced the winners of the annual Power of Partnerships Award, which recognizes the Si2 volunteer teams that have made the most significant contributions to the success of the electronic design automation industry.
GCT Semiconductor and Kyocera Sign Development and Partnership Agreement
GCT Semiconductor Holding Inc. and Kyocera announce a collaboration to develop a 5G reference platform for customer premise equipment (CPE) and fixed wireless access (FWA) devices.
JEDEC Approaches Finalization of HBM4 Standard
JEDEC Solid State Technology Association today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
Accenture Acquires Cientra to Expand Silicon Design Capabilities
Accenture has acquired Cientra, a silicon design and engineering services company, offering custom silicon solutions for global clients. The terms of the acquisition were not disclosed.
AEM Introduces the New Generation of Automated Burn-In Systems for AI and High Performance Compute Chip Testing
AEM announced today the launch of a new burn-in capability for its high-parallel test platform, AMPS.
