To advance soft robotics, skin-integrated electronics and biomedical devices, researchers at Penn State have developed a 3D-printed material that is soft and stretchable — traits needed for matching the properties of tissues and organs — and that self-assembles.
Design
Lightmatter Announces NVIDIA Executive Simona Jankowski as Chief Financial Officer
Lightmatter today announced the appointment of Simona Jankowski as Chief Financial Officer (CFO).
Altair Signs Agreement to Acquire Metrics Design Automation Inc.
Altair announced it has entered into a definitive agreement to acquire all of the outstanding capital stock of Metrics Design Automation Inc.
Lattice Introduces New Secure Control FPGA Family
Lattice Semiconductor, the low power programmable leader, today expanded its leadership in security-focused hardware and software with the launch of two new solutions to address customer challenges around increasing threats to system security.
Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.
Silicon Catalyst Ventures Launched to Support Early-stage Semiconductor Startups
Led by a team of seasoned investment and technology experts, in close collaboration with the Silicon Catalyst incubator.
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
Synopsys, Inc. today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
Xpeedic Releases EDA 2024 Platforms
Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation.
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NoC) and Physical Layer (PHY) interconnect IP solution.
