The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced the return of Dr. Douglas A. Grose as the non-profit organization’s appointed Board Chair.
Design
Skylo Certifies Sony’s Altair ALT1250 Chipset for its Satellite Network
Sony Semiconductor Israel’s Altair ALT1250 chipset is now certified by Skylo Technologies, ensuring seamless global connectivity across devices.
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Imec.xpand Launches EUR 300M Fund Amid Global Race for Semiconductor Supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
TSMC Certifies Ansys Multiphysics Platforms
Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.
AMD’s Dr. Lisa Su Named Chief Executive Magazine’s 2024 CEO of the Year
Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.