FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
Design
IDTechEx Summarizes the Emerging Adoption and Future Trends of SiC and GaN in EVs
In 2008, the commercialization of the silicon carbide (SiC) MOSFET marked a major turning point for the power semiconductor market, representing its first significant development in decades.
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Technology (OPENEDGES).
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Global Semiconductor Sales Increase 15.8% Year-to-Year in April
Worldwide chip sales increase 1.1% month-to-month in April, marking first month-to-month growth of 2024.
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet built on Arm Neoverse Compute Subsystems (CSS) for artificial intelligence/machine learning (AI/ML), high-performance compute (HPC), data centre and 5G/6G networking infrastructure applications.
Towards Next-Gen Functional Materials: Direct Observation of Electron Transfer in Solids
Researchers have developed a new nanotube crystal that enables the direct observation of electron transfer in solids.
New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce.
Navajo Technical University Partners with NSF Center
A partnership that began in 2017 between Navajo Technical University (NTU) and the U.S. National Science Foundation Materials Research Science and Engineering Center at Harvard University is providing Navajo students with new opportunities to pursue advanced degrees in science and engineering while helping to address critical issues facing the Navajo Nation.
eInfochips joins TSMC Design Center Alliance to Accelerate Semiconductor Innovation
eInfochips, an Arrow Electronics company, announced the company has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform® (OIP).
