Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
Design
Efabless Announces the Inaugural Chipalooza Analog and Mixed-Signal Design Challenge
Efabless Corporation, the creator platform for chips, is excited to announce the launch of the first Chipalooza Analog and Mixed-Signal Design Challenge, an innovative competition aimed at engineers and designers around the globe.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing
$1.5 billion potential investment will support the expansion of GlobalFoundries New York facility, including construction of a new state-of-the art fab, and the modernization of its Vermont facility, adding secure capacity for essential chip manufacturing for automotive and other key markets.
New Report Suggests India Can Expand Role in Global Semiconductor Value Chains with the Right Policies
The Semiconductor Industry Association (SIA) and the India Electronics and Semiconductor Association (IESA) today welcomed the release of a report evaluating India’s existing semiconductor ecosystem and policy frameworks and offering recommendations to facilitate longer-term strategic development of complementary semiconductor ecosystems in the U.S. and India.
SIA Applauds Launch of Over $5 Billion in CHIPS R&D Investments, Workforce Initiatives
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs.
Cadence and Dassault Systèmes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
Cadence Design Systems, Inc. and Dassault Systèmes today announced at 3DEXPERIENCE World that they have extended their ongoing strategic partnership by integrating the AI-driven Cadence OrCAD X and Allegro X with Dassault Systèmes’ extended 3DEXPERIENCE Works Portfolio, for SOLIDWORKS existing and future customers.
Silvaco Expands Sales Channel in Asia
Silvaco Group, Inc., a provider of TCAD, EDA software, and design IP, today announced that it has appointed new distributors in Vietnam and India to accelerate business growth in Asia.
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
