Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
Design
POET Announces Design Win and Collaboration with Foxconn Interconnect Technology
POET and FIT have entered into a collaboration to develop 800G and 1.6T pluggable optical transceiver modules using POET optical engines with an aim to address the growth in demand from cutting-edge AI applications and high-speed data center networks.
AI and Holography Bring 3D Augmented Reality to Regular Glasses
Combining advances in display technologies, holographic imaging, and artificial intelligence, engineers at Stanford say they have produced a leap forward for augmented reality.
2023 Global Semiconductor Materials Market Revenue Declines From 2022 Record High, SEMI Reports
Global semiconductor materials market revenue in 2023 contracted 8.2% to $66.7 billion from the market record of $72.7 billion set in 2022, SEMI reported today.
NY CREATES Welcomes Return of Dr. Douglas Grose as Board of Directors Chair
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced the return of Dr. Douglas A. Grose as the non-profit organization’s appointed Board Chair.
Skylo Certifies Sony’s Altair ALT1250 Chipset for its Satellite Network
Sony Semiconductor Israel’s Altair ALT1250 chipset is now certified by Skylo Technologies, ensuring seamless global connectivity across devices.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Imec.xpand Launches EUR 300M Fund Amid Global Race for Semiconductor Supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
TSMC Certifies Ansys Multiphysics Platforms
Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.
