Everspin Technologies, Inc. announced today the new brand name PERSYST for its persistent memory product family.
Design
KAIST Researchers Developed a Novel Ultra-Low Power Memory for Neuromorphic Computing
A team of Korean researchers is making headlines by developing a new memory device that can be used to replace existing memory or used in implementing neuromorphic computing for next-generation artificial intelligence hardware for its low processing costs and its ultra-low power consumption.
U.S. Department of Commerce Receives Over 160 Concept Plans for CHIPS for America Funding
Projects to play vital role in strengthening the U.S. semiconductor supply chain.
Global Semiconductor Sales Increase 16.3% Year-to-Year in February
Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
Old Crystal, New Story for Enhancing Deep Ultraviolet Laser Performance
In the realm of science and technology, harnessing coherent light sources in the deep ultraviolet (DUV) region holds immense significance across various applications such as lithography, defect inspection, metrology, and spectroscopy.
Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries
The flagship event of the global Thermal Management Expo portfolio, Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials.
Lidar Market Size Worth $ 5.16B, Globally, by 2031
The Global Lidar Market is projected to grow at a CAGR of 8.01% from 2024 to 2031, according to a new report published by Verified Market Research.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems.
SEMI ESD Alliance 2024 CEO Executive Outlook to Explore the Evolving RISC-V Movement and Semiconductor Design Ecosystem
Key executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies.
