Lam’s VizGlow multi-physics plasma simulation software provides chipmakers a compelling alternative that can dramatically reduce material costs of experiments, speed up development, and shorten time to market.
Design
Dr. Rick Tsai to Receive Global Semiconductor Alliance’s Highest Honor, the Dr. Morris Chang Exemplary Leadership Award
Global Semiconductor Alliance (GSA) proudly announces it will honor Dr. Rick (Lih Shyng) Tsai, the CEO and Vice Chairman of MediaTek with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on December 7, 2023.
Dukosi and Suzhou Hengmei Electron Technology Strengthen Partnership and Establish Joint Development Laboratory
Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of battery systems, and Suzhou Hengmei Electron Technology, Inc. today announced the Joint Development Laboratory at Hengmei’s facility in Suzhou, China.
SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era
The event, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and government.
KYOCERA AVX Provided Key Components for the Historic Chandrayaan-3 Lunar Mission
KYOCERA AVX contributed several components to the Pragyaan lunar rover, including stacked TCH Series surface-mount capacitors that became the first polymer capacitors to ever be used in a space mission.
Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process
Target production of the SoCs will be in 2026.
Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions
Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform (OIP) Partner of the year awards for 2023.
Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
Cadence Design Systems, Inc. today announced that it has won four Open Innovation Platform (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.
New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
Combining FlexNoC and Ncore from Arteris with Fraunhofer IESE DRAMSys4.0 enables customers to improve performance, reduce cost and accelerate the advanced DRAM-centric SoC development schedules.
