Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
Design
TSMC Certifies Ansys Multiphysics Platforms
Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.
AMD’s Dr. Lisa Su Named Chief Executive Magazine’s 2024 CEO of the Year
Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
Samsung Electronics Co., Ltd. today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
