An annual analysis of publicly available patent data from IP management firm Anaqua found that semiconductor technologies received the most granted patents in the US in 2023, the second year in a row that semiconductors have topped the list.
Design
Navitas and SHINRY Accelerate New-Energy Vehicles
The companies have opened an advanced, joint R&D power laboratory to accelerate the development of New-Energy Vehicle (NEV) power systems enabled by Navitas’ GaNFast™ technology.
Saras Micro Devices Opens New HQ in AZ
The company seeks to support and leverage growing semiconductor and advanced packaging ecosystem in the region
SEMI Applauds Announcement of European Economic Security Strategy
SEMI said the move as a positive and fundamental step forward in assuring Europe’s economic security. The strategy was initially announced in June 2023 in response to the pandemic and the rise in geopolitical tensions.
DoD Awards $49M for Advanced Semiconductor Packaging
The Department of Defense announced the award of two contracts totaling $49 million to revitalize advanced packaging capabilities and capacity for semiconductors used in defense applications.
Supercomputer Heads into Space
Expanding its venture into space computing, Hewlett Packard Enterprise (HPE) will launch an updated HPE Spaceborne Computer-2 to the International Space Station (ISS).
Sondrel Completes a Multi-Billion Transistor Chip Design at 5nm
UK-based Sondrel completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.
The ‘Blank Sheet’ that Delivered Intel’s SoC Design Change
Rethinking chip architecture from the ground up is no small feat. Intel Core Ultra is Intel’s biggest SoC design change in 40 years, and Wilson, a 22-year Intel veteran, says it took a unique team with a massive breadth of expertise.
Deirdre Hanford Appointed as CEO Of Natcast
Natcast announced the appointment of Deirdre Hanford as its founding Chief Executive Officer. The selection of Hanford will enable Natcast to begin operations in earnest in 2024.
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding
Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.
