Design

Keysight Launches Next-Generation Vector Signal Generator for Dense Wideband Multichannel Applications

Keysight Technologies, Inc. introduces a new compact, four-channel vector signal generator (VSG) capable of signal generation up to 8.5 GHz with 960 MHz of modulation bandwidth per channel.

New Metamaterial-Based Strategy to Combine and Transmit Multiple Light Modes

Innovative technique achieves unprecedented data transfer rates with on-chip optical communication.

Empire State Development Announces Application Window is Now Open for Luminate NY Accelerator and Business Competition

Empire State Development (ESD) today announced that Luminate NY—the world’s largest business accelerator for startup companies that have optics, photonics, and imaging (OPI) enabled technologies—is now accepting applications for its seventh cohort.

Archer’s Biochip gFET Design for Advanced Sensing Validated by Commercial Foundry Partner

Archer Materials’ commercial foundry partner in the Netherlands has validated its advanced biochip gFET design by manufacturing the chips using whole four-inch wafer semiconductor fabrication processes.

Aqua Membranes Collaborates with Micron Technology

Aqua Membranes, a water technology company specializing in sustainable reuse, is sharing preliminary results of an ongoing pilot project with memory chip giant, Micron Technology, Inc.

Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design

Cadence Design Systems, Inc. today unveiled its next-generation AI IP and software tools to address the escalating demand for on-device and edge AI processing.

Microchip Teams Up with Intelligent Hardware Korea

To address the rapid rise of Artificial Intelligence (AI) computing at the edge of the network and its associated inferencing algorithms, Intelligent Hardware Korea (IHWK)  is developing a neuromorphic computing platform for neurotechnology devices and field programmable neuromorphic devices.

Alchip Collaborates With Arteris To Expand ASIC Design Services

This collaboration can deliver highly optimized SoCs across various market segments.

MediaTek Successfully Develops First Chip Using TSMC’s 3nm Process, Set for Volume Production in 2024

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.

Semtech Appoints Mark Lin As Executive Vice President and Chief Financial Officer

Semtech Corporation, a high-performance semiconductor, IoT systems, and cloud connectivity service provider, announced today that its board of directors has appointed Mark Lin as Semtech’s new executive vice president and chief financial officer, succeeding Emeka Chukwu in that role.

Featured Products