Semtech Corporation and Oxit have announced a collaboration to enable device manufacturers to build a single device with the OxTech Multi-Connectivity Module.
Design
Metal Plating Chemicals Revenues to Boost into 2024
Growth driven by developments in leading edge logic and memory.
GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
This integration, one of the first complete RISC-V microcontrollers in an FPGA, provides designers the A25 processor power and the peripherals most processors require without consuming any FPGA resources.
SEMI SOI Industry Consortium Elects New Leadership and Governing Council and Announces Upcoming Events
SOI Industry Consortium (SOIIC), a SEMI Technology Community, today announced new leadership, Governing Council members and upcoming educational events for the ecosystem of chip designers, developers, and equipment and materials providers in the silicon on insulator ecosystem.
GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles
At its annual Technology Summit beginning today, GlobalFoundries (GF) (Nasdaq: GFS), announced advancements for two of its technology platforms that will support the growing demand for the technologies needed for autonomous, connected and electrified vehicles.
BrainChip Receives First Shipment of AKD1500 Chips in Silicon from Technology Partner GlobalFoundries
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, announced today that it has received its first shipment of AKD1500 chips in silicon from GlobalFoundries to advance the company’s IP into the next phase of development.
Scientists Edge Toward Scalable Quantum Simulations on a Photonic Chip
A system using photonics-based synthetic dimensions could be used to help explain complex natural phenomena.
Using DNA to Create a New Family of 3-Dimensional Nanotransistors
Using DNA technologies to create a new generation of tiny electronics components at low production costs: this is the main goal of the European-funded project 3D-BRICKS, coordinated by Istituto Italiano di Tecnologia (IIT-Italian Institute of Technology) in Genoa (Italy), and involving an interdisciplinary team of top researchers from Italy, Spain, Germany, Belgium, and Switzerland.
University Breaks Ground on One-of-a-Kind Semiconductor Facility
The University of Arkansas celebrated an important milestone with the groundbreaking on a building that Chancellor Charles Robinson suggested might someday rival the U of A’s most iconic structure, Old Main, in significance to the university and the state of Arkansas.
Silicon Fabricated Parts Market Forecasting High Growth
Increased layer technology and OLED growth driving demand for silicon parts.
