The Silicon Integration Initiative Compact Model Coalition has released a new version of the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.
Design
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.
Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
Ideal Power Successfully Completes Phase II of Development Program with Stellantis
Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker.
Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
Synopsys, Inc. today announced its AI-driven digital and analog design flows are certified by Intel Foundry for the Intel 18A process.
Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology
Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
Efabless Announces the Inaugural Chipalooza Analog and Mixed-Signal Design Challenge
Efabless Corporation, the creator platform for chips, is excited to announce the launch of the first Chipalooza Analog and Mixed-Signal Design Challenge, an innovative competition aimed at engineers and designers around the globe.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
