Santec Holdings Corporation, a manufacturer of advanced optical components, tunable lasers, optical test equipment, and OCT systems, announces the product launch of the extended range Swept Photonics Analyzer (SPA-110).
Design
Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD
Micron Technology, Inc. today announced it has begun qualification of the 6550 ION NVMe SSD with customers.
Physik Instrumente (PI) Expands Electronics Manufacturing in Rosenheim
Physik Instrumente (PI), the market and technology leader for high-precision positioning technology and piezo applications, has significantly expanded its electronics manufacturing site based in Rosenheim, Germany.
Georgia Tech Joins Apple’s New Silicon Initiative
The Georgia Tech School of Electrical and Computer Engineering (ECE) is expanding its collaboration with Apple by joining the company’s New Silicon Initiative (NSI) – a program that aims to prepare students for careers in hardware technology, computer architecture, and silicon chip design.
SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth
SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.
Solution to a Decade-Old Problem Will Free Up Quantum Computing Power
University of Sydney quantum researchers Dominic Williamson and Nouédyn Baspin have revealed a transformative new architecture for managing errors that emerge in the operation of quantum computers.
Siemens Launches Innexis Product Suite
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its Veloce hardware-assisted verification and validation system.
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.
ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM
New TEM preparation platform with industry-leading automation yield.
New DUV Micro-LED Array Advances Maskless Photolithography
A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.
