Design

Rapid Fabrication of a Polymer Lens on a Laser Chip for Miniaturized Spectroscopy

Two-photon-polymerization 3D printing is successfully exploited to reduce the divergence of a vertical laser diode to be integrated in a compact optical gas sensor.

SEMI FlexTech Announces 2023 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics

Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2023 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2023 in San Francisco.

Samsung Starts Mass Production of Automotive UFS 3.1  Memory Solution with Industry’s Lowest Power Consumption

New UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.

Siemens Unveils Calibre DesignEnhancer for Correct-by-Construction IC Layout Optimization

Siemens Digital Industries Software today introduces Calibre DesignEnhancer software.

Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports

Electronic System Design (ESD) industry revenue increased 12% from $3,527.7 million in the first quarter of 2022 to $3,951.1 million in the first quarter of 2023, the ESD Alliance announced today in its latest Electronic Design Market Data (EDMD) report.

SEMI and Semiconductor Digest Announce 2023 Best of West Award Finalists

SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco.

SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent

Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.

What’s in the July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.

3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West

Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.

Redox-Based Transistor as a Reservoir System for Neuromorphic Computing

With major breakthroughs in artificial intelligence, image recognition, and object detection, the field of computing has witnessed a remarkable revolution in recent times.

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