Electronic System Design (ESD) industry revenue increased 25.2% to $4,702.4 million in the third quarter of 2023 from the $3,756.3 million logged in the third quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Design
TI Debuts New Automotive Chips at CES
Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.
Low-Cost Microscope Projection Photolithography System for High-Resolution Fabrication
Scientists from the Leibniz University Hannover have developed a low-cost and user-friendly fabrication technique, called UV-LED-based microscope projection photolithography (MPP), for rapid high-resolution manufacturing of optical elements within seconds.
A KAIST Research Team Develops High-Performance Stretchable Solar Cells
A KAIST research team from the Department of Chemical and Biomolecular Engineering (CBE) led by Professor Bumjoon Kim announced the development of a new conductive polymer material that achieved both high electrical performance and elasticity while introducing the world’s highest-performing stretchable organic solar cell.
Biden-Harris Administration Announces CHIPS Preliminary Terms with Microchip Technology
The Biden-Harris Administration announced that the U.S. Department of Commerce and Microchip Technology Inc. have reached a non-binding preliminary memorandum of terms (PMT) to provide approximately $162 million in federal incentives under the CHIPS and Science Act to support the onshoring of the company’s semiconductor supply chain.
Presto Engineering Announces ISO27001 Certification
Presto Engineering announced that it has successfully passed ISO27001 certification, which is the global standard for an effective information security management system.
Key Foundry Changes Its Name to “SK keyfoundry”
Key Foundry, an 8-inch pure-play foundry in Korea, announced today that it has changed its corporate name to SK keyfoundry.
Chiplet Summit Announces Its Initial Keynote Schedule With Emphasis on AI Applications
The second annual Chiplet Summit, to occur on February 6-8 at the Santa Clara Convention Center, has now set its initial keynote schedule.
Himax to Feature Exclusive Next Gen Color Sequential Front-Lit LCoS and 3D Sensing Technologies at CES 2024
Himax Technologies, Inc. today announced the Company will feature live showcases of its next generation proprietary ultra luminous Color Sequential Front-Lit LCoS and agile 3D Sensing technologies in a range of immersive AR applications at CES 2024, the largest consumer electronics show in Las Vegas, U.S.A. from January 9 – 12, 2024.
Laser-Driving A 2D Material
Writing in Nature Communications on November 24, engineers at Columbia and theoretical collaborators at the Max Planck for the Structure and Dynamics of Matter find that pairing laser light to crystal lattice vibrations can enhance the nonlinear optical properties of a layered 2D material.
