Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC and Ansys Totem power integrity signoff solutions for Samsung’s latest 2nm silicon process technology.
Design
Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development
Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships.
Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification
Airbus and STMicroelectronics have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles.
OMNIVISION Adds Two New Products to Its Broad Family of Global Shutter Sensors
OMNIVISION today announced two new additions to its Nyxel near-infrared (NIR) technology family.
Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing
Intel makes new quantum chip available to university and federal research labs to grow the quantum computing research community.
Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
Cadence Design Systems, Inc. today announced that it has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications.
Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
Synopsys, Inc. today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs.
D2S Receives Milestone Order for 50th GPU-Based Computational Design Platform for Optimizing Semiconductor Manufacturing
D2S today announced that it has received a milestone order for its 50th GPU-accelerated computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing applications.
Introducing Lykos: Esmo Group’s BIB Loader/Unloader for the Semiconductor Industry
esmo group (esmo) announced the launch of its latest innovation, lykos, a modular Burn-in Board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors.
Efabless Reveals Winners of AI-Generated Silicon Design Challenge
Efabless Corporation, the creator platform for chips, today announced the winners of its AI Generated Open-Source Silicon Design Challenge.
