Company continues rich 10 year history in Connecticut with new facility through 2029.
Design
Novel Ferroelectrics for More Efficient Microelectronics
A team of researchers from Carnegie Mellon University and Penn State University is exploring novel materials that have potential to make microelectronics more energy efficient.
Micron Announces High-Capacity, High-Performance RDIMM Memory Solutions
Micron Technology, Inc. today announced volume production availability of high-capacity 96GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory.
SK hynix Begins Mass Production of Industry’s Highest 238-Layer 4D NAND
SK hynix Inc. announced today that it has started mass production of its 238-layer 4D NAND Flash memory, following the development in August 2022, and that product compatibility test with a global smartphone manufacturer is underway.
Global Semiconductor Sales Increase 0.3% Month-to-Month in April
Worldwide chip sales down 21.6% year-to-year; latest industry forecast projects annual downturn of 10.3% in 2023 followed by growth of 11.9% in 2024.
Physicists Uncover “Parallel Circuits” of Spin Currents in Antiferromagnets
A group of physicists at Hefei Institutes of Physical Science (HFIPS) of Chinese Academy of Sciences (CAS) revealed a secret of antiferromagnets, which could accelerate spintronics, a next-gen data storage and processing technology for overcoming the bottleneck of modern digital electronics.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Nidec and Renesas Collaborate on Semiconductor Solutions for Next-Generation E-Axle for EVs
Nidec Corporation and Renesas Electronics Corporation have agreed to join forces on the development of semiconductor solutions for a next-generation E-Axle (X-in-1 system) that integrates an EV drive motor and power electronics for electric vehicles (EVs).
Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Node
Tackling extremely complex mobile chip designs on advanced nodes down to 2nm, Synopsys, Inc. (Nasdaq: SNPS) has strengthened its AI-enhanced design collaboration with Arm as the company announces Arm Total Compute Solutions 2023 (TCS23) platform today at Computex.
COMSOL Launches Open-Access Learning Center for Multiphysics Modeling
COMSOL, the developer of the COMSOL Multiphysics simulation software, has introduced a new online resource that provides free and open access to modeling and simulation learning material across all areas of physics.
