This breakthrough paves the way for the development of next-generation ultra-low-power devices and is anticipated to make significant contributions to quantum and AI research.
Design
Singapore-based Start-up SiNBLE Launches IC Design Implementation Service
Singapore-based start-up SiNBLE announced its official launch today, offering the integrated circuit (IC) and subsystem design implementation service.
Breakthrough in Computer Chip Energy Efficiency Could Cut Data Center Electricity Use
Researchers at Oregon State University and Baylor University have made a breakthrough toward reducing the energy consumption of the photonic chips used in data centers and supercomputers.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells
The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.
Micron Launches U.S.-Japan University Partnership
Eleven-university strong network to grow the next-generation workforce and advance semiconductor-based research in both countries.
The COMSOL Conference Returns to Munich in 2023
The COMSOL Conference is returning in person this year in Munich, Germany, on October 25–27.
Efabless Announces AI Generated Open-Source Silicon Design Challenge
Efabless Corporation today announced its AI Generated Open-Source Silicon Design Challenge which provides a hands-on opportunity to experience how simple it can be to use AI to create and tapeout chip designs in days or even hours.
Massachusetts Launches Portal for Companies Seeking Federal CHIPS Act Funds
The Center for Advanced Manufacturing at MassTech (CAM) has launched a new online portal that creates a single ‘digital front door’ for Massachusetts companies that are preparing proposals to the federal CHIPS Act, a major $50 billion dollar federal initiative designed to “strengthen and revitalize the U.S. position in semiconductor research, development, and manufacturing.”
Final Call: Applications for the 2nd Tech Innovation Excellence Award (TIE Award)
The deadline for applications for the 2nd Tech Innovation Excellence Award (TIE Award) is approaching.
