Cadence Design Systems, Inc. and Rambus Inc. today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business.
Design
Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
Synopsys, Inc. technology is unleashing a new wave of advanced designs with the industry’s broadest portfolio of interface IP for the TSMC N3E process.
System Companies Shake Up Semis with Middle Man Cuts, Vertical Shifts, and More
The economic death of Moore’s Law brings a simpler semiconductor value chain, the rise of system companies, software ownership, cuts to the middle man, vertical shifts, and IP M&As.
Gelest Breaks Ground on New Production Facility
Gelest, Inc., a Mitsubishi Chemical Group company, marks a new milestone with the groundbreaking of its latest production facility.
SEMI Announces SEMICON West 2024 Dates – July 9-11
SEMICON West is moving to Phoenix for a five-year annual rotation and shifting from its longstanding July event dates to October beginning in 2025.
Protons Set to Power Next-Generation Memory Devices
A proton-mediated approach that produces multiple phase transitions in ferroelectric materials could help develop high-performance memory devices, such as brain-inspired, or neuromorphic, computing chips, a KAUST-led international team has found.
Rapid Fabrication of a Polymer Lens on a Laser Chip for Miniaturized Spectroscopy
Two-photon-polymerization 3D printing is successfully exploited to reduce the divergence of a vertical laser diode to be integrated in a compact optical gas sensor.
SEMI FlexTech Announces 2023 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics
Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2023 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2023 in San Francisco.
Samsung Starts Mass Production of Automotive UFS 3.1 Memory Solution with Industry’s Lowest Power Consumption
New UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.
Siemens Unveils Calibre DesignEnhancer for Correct-by-Construction IC Layout Optimization
Siemens Digital Industries Software today introduces Calibre DesignEnhancer software.
