Nexperia, the expert in essential semiconductors, today announced an expansion to its range of Power ICs with Energy Harvesting solutions to simplify and enhance the performance of low-power internet of things (IoT) and other embedded applications.
Design
Silanna UV Presents High Power 235nm far UVC LEDs Using New SPSL Technology
New technology that pushes the boundaries of far UVC LEDs to emit at shorter wavelengths, at higher power, and with longer lifetimes, will be presented by Silanna UV at the International Conference on UV LED Technologies & Applications (ICULTA) in Berlin, Germany from April 23 to 26, 2023.
Sondrel Signs EDA License Extension with Siemens for Three More Years
As Electronic Design Automation (EDA) software is vital to its business, Sondrel (Holdings) plc, has secured the continuity of its use of Siemens EDA software with a significant multi-year contract.
DENSO Develops Its First Inverter Using SiC Power Semiconductors
Significantly reduce power loss in electric vehicles with its high efficiency.
Critical Manufacturing Announces MESI 4.0 Summit: Connect for a Smarter Future
The MES & Industry 4.0 International Summit, to be held on September 7 – 8, 2023 at Alfândega Congress Centre in Porto, is aimed to help manufacturers ‘Connect for a Smarter Future’.
U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina
Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.
New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
New Resources for CHIPS Applicants
Today, the Department of Commerce is releasing pre-application and application instructions, guidebooks, and other resources for the first CHIPS for America funding opportunity for leading-edge, current-generation, mature-node, and back-end semiconductor fabrication facilities.
Scientists Integrate Two-Dimensional Materials Into Silicon Microchips for Advanced Data Storage and Computation
A team of scientists at King Abdullah University of Science and Technology (KAUST) led by Dr. Mario Lanza, associate professor of materials science and engineering, has successfully integrated two-dimensional materials on silicon microchips, and achieved excellent integration density, electronic performance and yield.
Gordon Moore, Intel Co-Founder, Dies at 94
Intel and the Gordon and Betty Moore Foundation announced that company co-founder Gordon Moore died on March 24, 2023, at the age of 94.
