Design

Breakthrough in Computer Chip Energy Efficiency Could Cut Data Center Electricity Use

Researchers at Oregon State University and Baylor University have made a breakthrough toward reducing the energy consumption of the photonic chips used in data centers and supercomputers.

Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C

Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.

XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells

The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.

Micron Launches U.S.-Japan University Partnership

Eleven-university strong network to grow the next-generation workforce and advance semiconductor-based research in both countries.

The COMSOL Conference Returns to Munich in 2023

The COMSOL Conference is returning in person this year in Munich, Germany, on October 25–27.

Efabless Announces AI Generated Open-Source Silicon Design Challenge

Efabless Corporation today announced its AI Generated Open-Source Silicon Design Challenge which provides a hands-on opportunity to experience how simple it can be to use AI to create and tapeout chip designs in days or even hours.

Massachusetts Launches Portal for Companies Seeking Federal CHIPS Act Funds

The Center for Advanced Manufacturing at MassTech (CAM) has launched a new online portal that creates a single ‘digital front door’ for Massachusetts companies that are preparing proposals to the federal CHIPS Act, a major $50 billion dollar federal initiative designed to “strengthen and revitalize the U.S. position in semiconductor research, development, and manufacturing.”

Final Call: Applications for the 2nd Tech Innovation Excellence Award (TIE Award)

The deadline for applications for the 2nd Tech Innovation Excellence Award (TIE Award) is approaching.

Enablence Technologies Ramps Capacity at Fremont Fab

Enablence Technologies Inc. and Noel Technologies announced today a strategic partnership designed to substantially ramp production of Enablence’s planar lightwave products at its Fremont, California wafer fab.

Electronics Industry Welcomes Reintroduction of Bipartisan Proposal to Boost U.S. Printed Circuit Board Sector

The electronics manufacturing industry is welcoming the reintroduction of bipartisan legislation in the U.S. Congress that would help rebuild the country’s printed circuit board (PCB) sector.

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