The U.S. Department of Defense has announced that the Southwest Advanced Prototyping Hub (SWAP Hub) based at Arizona State University (ASU) has secured $5.7M in funding through the CHIPS and Science Act for an innovative project led by Alphacore Inc. to advance radio frequency (RF) transceiver technology to improve national defense and commercial capabilities.
Design
Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
Alphawave Semi announced its recognition as the recipient of the TSMC 2024 OIP Partner of the Year Award for High-Speed SerDes IP.
An Edible Toothpaste-Based Transistor
A toothpaste-based transistor is the latest innovation from the research team at the Istituto Italiano di Tecnologia (IIT-Italian Institute of Technology) in Milan, which pushes the boundaries of edible electronics.
Qamcom Collaborates with Pragmatic and Harvard on Applications in Wearables, Healthcare, and Smart Packaging
Qamcom, a knowledge-based research and technology consulting company within hardware, software and system development, announces joint research project and publication of article ‘Bendable non-silicon RISC-V microprocessor’.
Critical Manufacturing Welcomes Jeff Winter as Head of Business Strategy
Critical Manufacturing announced the appointment of Jeff Winter as VP of Business Strategy.
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
Cadence Design Systems, Inc. today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.
Tachyum Expands European Hub with New Offices in Czech Republic
Tachyum today announced the opening of new positions in Brno, Czech Republic, to support the company’s continued growth as it nears tape-out of the Prodigy Universal Processor Chip.
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners.
