GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
Design
Egis Group Announces Strategic Collaboration with Arm
This collaboration enables both Egis and Alcor Micro to leverage Neoverse CSS for new chiplet solutions targeting the High-Performance Computing (HPC) and generative AI application markets, combining the strength of Egis’ specialized integrated circuit design and the power efficiency of Arm technology.
Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs
Rambus Inc. today unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs).
Spin-Wave Reservoir Chips Can Prove Revolutionary in the Edge Computing Technology
“Our ultimate goal is to establish edge computing technology utilizing spin-wave reservoir chips, with the aim of developing a wide range of applications including biomedical imaging and autonomous vehicles.” said Sekiguchi.
Seoul Semiconductor’s Patent Enforcement Leads to LED Sales Ban of Infringing Products in Eight European Countries
Seoul Semiconductor Co., Ltd. and its affiliate Seoul Viosys announces that the Unified Patent Court has issued a judgment ordering a sales ban, recall and destruction of products infringing Seoul’s “No Wire” (WICOP) patent in eight European countries.
Mouser Electronics Celebrates Its 2024 Best-in-Class Award Winners
Mouser Electronics, Inc. announced the 2024 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on October 10 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.
IMEC Announces Commitments to Automotive Chiplet Program
This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
Research to Use Machine Learning to ’Reverse-Engineer’ New Composite Materials
Professors receive NSF grant for deep-learning model that can customize microarchitecture based on specific needs.
Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
Silicon Labs, in partnership with Kudelski IoT, a division of the Kudelski Group, today announced a new solution to accelerate the time to market for Matter-certified IoT devices.
