Spin-transfer-torque magnetoresistive random access memory (STT-MRAM) continues to stand out by meeting critical demands for high endurance, non-volatility, and low latency, particularly in applications at the far edge.
Design
2025: MEMS Mirrors Will Fix Automotive LiDAR
Driven by advancements in the MEMS mirrors used in light detection and ranging (LiDAR), Tier 1 suppliers and automakers will begin to design more accurate, resilient, and affordable perception systems in automotive vehicles.
2025: Wafer Bonding is the New Semiconductor Scaling
To continue scaling the power density of future semiconductor components, there is no way around 3D integration. Depending on the system requirements, various bonding technologies such as solder connections, thermocompression and hybrid bonding can be selected.
2025: The Increasing Importance of High-Performance Power Management
Power management devices, which include voltage regulators and power converters, are critical components that ensure optimal energy consumption and performance in the most advanced electronic systems, including artificial intelligence (AI) and machine learning.
2025: Power Density and Sustainability Shaping Semiconductor Landscape
As devices become more compact and powerful, traditional packaging methods are no longer sufficient. Techniques such as system-in-package (SiP) and 3D packaging will gain traction, enabling higher performance while minimizing space and volume.
2025: AI Momentum Continues
The optical interposer, which POET pioneered, is gaining traction as a platform technology that can meet the high-volume production requirements of AI clusters while reducing cost and power consumption.
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
2025: Photonic Integrated Circuits – Driving Quantum Technology
Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.
2025: Optimizing Automated Test Equipment for the Era of AI and Beyond
The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems
As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.
